X-On Electronics has gained recognition as a prominent supplier of XC7SH125GM Unclassified across the USA, India, Europe, Australia, and various other global locations. XC7SH125GM Unclassified are a product manufactured by NXP. We provide cost-effective solutions for Unclassified, ensuring timely deliveries around the world.

XC7SH125GM NXP

XC7SH125GM electronic component of NXP
Images are for reference only
See Product Specifications
Part No.XC7SH125GM
Manufacturer: NXP
Category: Unclassified
Description: IC, BUFFER/LINE DRIVER, 3-ST, XSON6
Datasheet: XC7SH125GM Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 0.1096 ea
Line Total: USD 0.11

Availability - 0
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0
Ship by Fri. 02 Aug to Thu. 08 Aug
MOQ : 1
Multiples : 1
1 : USD 0.1096

   
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Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the XC7SH125GM from our Unclassified category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the XC7SH125GM and other electronic components in the Unclassified category and beyond.

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AN10343 MicroPak soldering information Rev. 2 30 December 2010 Application note Document information Info Content Keywords MicroPak, footprint, Ball Grid Array (BGA), Wafer-Level Chip Scale Package (WLCSP) Abstract This application note describes evaluation of recommended solder land patterns for mounting MicroPak packagesAN10343 NXP Semiconductors MicroPak soldering information Revision history Rev Date Description v.2 20101230 text and graphics updated to latest standards Contact information For more information, please visit:

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NXP / Freescale
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PH3
PHI

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