OSD335x BAS/IND Datasheet Rev. 16 1/1/2021 Introduction The OSD335x Family of System-In- Package (SIP) products are building blocks designed to allow easy and cost-effective implementation of systems based on Texas Instruments powerful Sitara AM335x line of processors. The OSD335x integrates the AM335x along with the TI TPS65217C PMIC, the TI TL5209 LDO, up to 1 Gigabyte of DDR3 Memory, and resistors, capacitors, and inductors all into a single 27mm x 27mm design-in-ready package. With this level of integration, the OSD335x Family of SIPs allows designers to focus on OSD335x Block Diagram the key aspects of their system without spending time on the complicated high- PWR Out: 1.8V, 3.3V and SYS speed design of the processor/DDR3 AM335x I/O Voltage: 3.3V interface or the PMIC power distribution. It also reduces the overall size and complexity of the design and the supply chain. The Benefits OSD335x can significantly decrease the time to market for AM335x-based products. Integrates over 100 components into one package Features Compatible with AM335x development tools and software TI AM335x, TPS65217C, TL5209, Wide BGA ball pitch allows for low- DDR3, and over 140 Passive cost assembly. components integrated into a single Significantly reduces design time package Decreases layout complexity TI AM335x Features: 35% reduction in board space vs o ARM Cortex-A8 up to 1GHz discrete implementation o 8 channel 12-bit SAR ADC Increased reliability through reduced o Ethernet 10/100/1000 x2 number of components o USB 2.0 HS OTG + PHY x2 o MMC, SD and SDIO x2 o LCD Controller o SGX 3D Graphics Engine Package o PRU Subsystem Access to All AM335x Peripherals: 400 Ball BGA (27mm X 27mm) CAN, SPI, UART, I2C, GPIO, etc. 20 X 20 grid, 1.27mm pitch Up to 1GB DDR3 Temp Range: 0 to 85C, -40 to 85C PWR In: AC Adapter, USB or Single cell (1S) Li-Ion / Li-Po Battery Octavo Systems LLC Copyright 2016-2021 2 OSD335x BAS/IND Datasheet Rev. 16 1/1/2021 Table of Contents 1 Revision History ....................................................................................... 4 2 Block Diagram ......................................................................................... 5 2.1 Passives ........................................................................................... 6 2.1.1 Additional Required Bulk Capacitance .................................................. 6 2.1.2 Integrated Bulk Capacitance ............................................................. 6 2.1.3 Integrated Resistors ........................................................................ 7 3 Product Number Information ........................................................................ 8 4 Reference Documents ............................................................................... 10 4.1 Data Sheets ...................................................................................... 10 4.2 Other Reference ................................................................................ 10 5 Ball Map ............................................................................................... 11 5.1 Ball Description ................................................................................. 17 5.2 AM335x Relocated Signals ..................................................................... 20 5.3 Not Connected Balls ............................................................................ 20 5.4 Reserved Signals ................................................................................ 21 6 OSD335x Components ............................................................................... 22 6.1 AM335x Processor ............................................................................... 22 6.1.1 I/O Voltages ................................................................................ 22 6.2 DDR3 Memory.................................................................................... 22 7 Power Management .................................................................................. 24 7.1 Input Power...................................................................................... 24 7.1.1 VIN AC ...................................................................................... 24 7.1.2 VIN USB ..................................................................................... 24 7.1.3 VIN BAT ..................................................................................... 24 7.2 Output Power ................................................................................... 24 7.2.1 SYS VOUT: Switched VIN AC, VIN USB, or VIN BAT ................................. 24 7.2.2 SYS VDD1 3P3V............................................................................ 25 7.2.3 SYS VDD2 3P3V............................................................................ 25 7.2.4 SYS RTC 1P8V ............................................................................. 25 7.2.5 SYS VDD 1P8V ............................................................................. 25 7.2.6 SYS ADC 1P8V ............................................................................. 25 Octavo Systems LLC Copyright 2016-2021