TAP1000 & 2000 1000 & 2000 Watt Heat Sinkable Planar The TAP series delivers 1000W or 2000W of contin- uous power when properly mounted to a liquid cooled heat sink (based on 85C mounting plate tempera- FeATures APPlicATions ture) High Energy Rating Power semiconductor balancing Applications include Low Inductance Motor control power conditioning, power distribution, power conver- Resistor Element Electrically Isolated Inrush Current Limiting sion, and power control. High Dielectric Strength Small Footprint chArAcTerisTics Resistor Element Thick Film on Alumina Rating Test Continuous Pulse Substrate Rated Power, max. current and heat sink plate (TA1K0) 1000W Power Rating 1000W or 2000W at temperature limited 85C mounting plate (TA2K0) 2000W Resistance Values 0.5 to 1000 Operating Voltage P*R N/A Resistance Tolerance +10% std. Max. Applied Voltage, ohms law limited 223V 2000VDC 2000VDC 10A 53.33A Max Operating Voltage Max. Current Temperature Coefficient 250 PPM/C Critical Resistance below this resistance max (TA1K0) 10 power has to be de-rated due to exceeding max (TA2K0) 20 Dielectric Strength 6KV standard current Operating Temperature -55C to 85C Range Test Method Maximum R Terminal Screws 10-32 1.14 x P*R / 10 sec 70C Max % Rsto = Short Time (2% + 0.05) 10 in-lb Overload Max Contacts Torque Moisture (TA1K0) 1000 hrs 40C, 90-95% RH 1% Mounting Screws 8-32 Resistance 1% (TA2K0) 1750 hrs 40C, 90-95% RH Max Mounting Torque 15 in-lb Thermal Shock MIL-STD-202, Method 107 MIL-STD-202, Creepage Distance 50mm 1mm (min) Method 107 MIL-STD-202, Method 201 2% Resistance Vibration, elec. Derating Vibration, mech. MIL-STD-202, Method 201 No Loose 100 Terminal Screws 80 Load Life (TA1K0) 1000 Hrs 90 min ON / 30 min OFF 1% 1% (TA2K0) 1750 Hrs 90 min ON / 30 min OFF 60 52F 2KV / 60 sec intervals, 104J, 1% Pulse Tolerance 40 20,000 Pulses 20 Dielectric 6KVDC for 1 minute 1% 0 Strength 0 2550 85 100 125 150 Bottom of base plate Temperature, C (continued) 144 1-866-9-OHMITE Intl 1-847-258-0300 Fax 1-847-574-7522 www.ohmite.com info ohmite.com Percent Rated WattsTAP1000 & 2000 1000 & 2000 Watt Heat Sinkable Planar dimensions APPlicATion noTes (in./mm) Proper heat sinking techniques are essential to performance of 0.193 0.689 a TAP resistor. Pleased follow these guidelines when designing 0.172 (4.89mm) (17.50mm) (4.37mm) 10-32 TAP system: Heats sink plate (base plate of the resistor) temperature must be monitored to establish proper de-rating. Best tech- 1.308 nique is to attach a thermocouple to the side of the base (33.21mm) plate of the resistor. Temperature of plastic housing or heat sink cannot be used to establish rating of the resistor. Usage 1.622 3.000 of laser thermometers should be avoided. (41.20mm) (76.20mm) To obtain a power rating of 1000W or 2000W, the bottom 1.308 case temp must not exceed 85C. This can only be achieved (33.21mm) if the thermal conduction to the heatsink Rth-cs<0.025K/W. This value can be reached by using thermal transfer com- pound with a heat conductivity of 1W/mK. The flatness of the cooling plate must be better than 0.05mm overall. The (same dimensions) roughness of the surface should not exceed 6.4m. 0.300 (7.62mm) Due to very high power density, only liquid cooled heat sinks 0.450 are recommended for applications when >300W power rating (11.43mm) is desired. 0.798 Properly designed heat sink should have more than 2 cooling (20.26mm) 0.188 pipes under the surface of the TAP resistor. The Ohmite CP4 (4.76mm) heat sink (