7SB3257DFT2G ON Semiconductor

L 7SB3257 Mux / Demux Bus Switch The 7SB3257 Mux / Demux Bus Switch is an advanced highspeed line switch in ultrasmall footprint. Features High Speed: t = 0.25 ns (Max) V = 4.5 V PD CC 7SB3257 Table 1. MAXIMUM RATINGS Symbol Parameter Value Unit V DC Supply Voltage 0.5 to +7.0 V CC V Control Pin Input Voltage 0.5 to +7.0 V IN V Switch Input / Output Voltage 0.5 to +7.0 V I/O I Control Pin DC Input Diode Current V < GND 50 mA IK IN I Switch I/O Port DC Diode Current V < GND 50 mA OK I/O I OnState Switch Current 128 mA O Continuous Current Through V or GND 150 mA CC I DC Supply Current per Supply Pin 150 mA CC I DC Ground Current per Ground Pin 150 mA GND T Storage Temperature Range 65 to +150 C STG T Lead Temperature, 1 mm from Case for 10 Seconds 260 C L T Junction Temperature Under Bias 150 C J Thermal Resistance SC88 / TSOP6 (Note 1) 333 C/W JA ULLGA6/UDFN6 496 P Power Dissipation in Still Air at 85C SC88 / TSOP6 (Note 1) 200 mW D ULLGA6/UDFN6 252 MSL Moisture Sensitivity Level 1 F Flammability Rating Oxygen Index: 28 to 34 UL 94 V0 0.125 in R V ESD Withstand Voltage Human Body Mode (Note 2) >2000 V ESD Machine Mode (Note 3) >200 Charged Device Mode (Note 4) N/A I Latchup Performance Above V and Below GND at 85C (Note 5) 100 mA LATCHUP CC Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Measured with minimum pad spacing on an FR4 board, using 10 mmby1 inch, 2 ounce copper trace no air flow. 2. Tested to EIA/ JESD22A114A 3. Tested to EIA/ JESD22A115A 4. Tested to JESD22C101A 5. Tested to EIA / JESD78. Table 2. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Unit V Positive DC Supply Voltage 4.0 5.5 V CC V Control Pin Input Voltage 0 5.5 V I V Switch Input / Output Voltage 0 5.5 V I/O T Operating FreeAir Temperature 55 +125 C A t / V Input Transition Rise or Fall Rate Control Input 0 5 nS/V Switch I/O 0 DC Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability.