ADM1032ARZ-REEL ON Semiconductor

ADM1032 1 C Remote and Local System Temperature Monitor The ADM1032 is a dual-channel digital thermometer and under/overtemperature alarm intended for use in PCs and thermal management systems. The device can measure the temperature of a remote thermal diode, which can be located on the processor die or can ADM1032 ADDRESS POINTER REGISTER ON-CHIP CONVERSION RATE TEMPERATURE REGISTER SENSOR LOCAL TEMPERATURE LOCAL TEMPERATURE LOW LIMIT REGISTER VALUE REGISTER LOCAL TEMPERATURE D+ 2 HIGH LIMIT REGISTER A/D ANALOG LIMIT CONVERTER MUX COMPARATOR REMOTE TEMPERATURE 3 D LOW LIMIT REGISTER RUN/STANDBY BUSY REMOTE TEMPERATURE REMOTE TEMPERATURE HIGH LIMIT REGISTER VALUE REGISTER LOCAL THERM LIMIT REGISTER REMOTE OFFSET EXTERNAL THERM LIMIT REGISTER REGISTER CONFIGURATION REGISTER EXTERNAL DIODE OPEN-CIRCUIT INTERRUPT 6 ALERT STATUS REGISTER MASKING THERM 4 ADM1032 SMBUS INTERFACE 1 5 7 8 V GND SDATA SCLK DD Figure 1. Functional Block Diagram Table 1. ABSOLUTE MAXIMUM RATINGS Parameter Rating Unit Positive Supply Voltage (V ) to GND 0.3, +5.5 V DD D+ 0.3 to V + 0.3 V DD D to GND 0.3 to +0.6 V SCLK, SDATA, ALERT 0.3 to +5.5 V THERM 0.3 to V + 0.3 V DD Input Current, SDATA, THERM 1, +50 mA Input Current, D 1 mA ESD Rating, All Pins (Human Body Model) > 1000 V Maximum Junction Temperature (T ) 150 C J Max Storage Temperature Range 65 to +150 C IR Reflow Peak Temperature 220 C IR Reflow Peak Temperature for Pb-Free 260 C Lead Temperature (Soldering 10 sec) 300 C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. NOTE: This device is ESD sensitive. Use standard ESD precautions when handling. Table 2. THERMAL CHARACTERISTICS Package Type Unit JA 8-lead SOIC NB Package 121 C 8-lead MSOP Package 142 C