ON Semiconductor Is Now To learn more about onsemi, please visit our website at www.onsemi.com onsemi andand other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba onsemi or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided as-is and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. Typical parameters which may be provided in onsemi data sheets and/ or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals must be validated for each customer application by customers technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and holdo nsemi and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. Other names and brands may be claimed as the property of others. FDB8870-F085 N-Channel PowerTrench MOSFET FDB8870-F085 N-Channel PowerTrench MOSFET 30V, 160A, 3.9m Features r = 3.9m, V = 10V, I = 35A General Description DS(ON) GS D This N-Channel MOSFET has been designed specifically to r = 4.4m, V = 4.5V, I = 35A DS(ON) GS D improve the overall efficiency of DC/DC converters using either synchronous or conventional switching PWM High performance trench technology for extremely low controllers. It has been optimized for low gate charge, low r DS(ON) r and fast switching speed. DS(ON) Low gate charge Applications High power and current handling capability DC/DC converters Qualified to AEC Q101 RoHS Compliant D GATE G SOURCE S DRAIN TO-263AB S (FLANGE) FDB SERIES MOSFET Maximum Ratings T = 25C unless otherwise noted C Symbol Parameter Ratings Units V Drain to Source Voltage 30 V DSS V Gate to Source Voltage 20 V GS Drain Current o 160 A Continuous (T = 25 C, V = 10V) (Note 1) C GS o I Continuous (T = 25 C, V = 4.5V) (Note 1) 150 A D C GS o o Continuous (T = 25 C, V = 10V, with R = 43 C/W) 23 A amb GS JA Pulsed Figure 4 A E Single Pulse Avalanche Energy (Note 2) 300 mJ AS Power dissipation 160 W P D o o Derate above 25C1.07W/ C o T , T Operating and Storage Temperature -55 to 175 C J STG Thermal Characteristics o R Thermal Resistance Junction to Case TO-263 0.94 C/W JC o R Thermal Resistance Junction to Ambient TO-263 ( Note 3) 62 C/W JA 2 o R Thermal Resistance Junction to Ambient TO-263, 1in copper pad area 43 C/W JA Package Marking and Ordering Information Device Marking Device Package Reel Size Tape Width Quantity FDB8870 TO-263AB 330mm 24mm 800 units FDB8870-F085 2010 Semiconductor Components Industries, LLC. Publication Order Number: September-2017, Rev. 2 FDB8870-F085/D