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V = 10 V, I = 75 A This N-Channel MOSFET is produced using Fairchild Semicon- DS(on) GS D ductors advanced PowerTrench process that has been tai- Low FOM R *Q DS(on) G lored to minimize the on-state resistance while maintaining Low Reverse Recovery Charge, Q rr superior switching performance. Soft Reverse Recovery Body Diode Enables Highly Efficiency in Synchronous Rectification Applications Fast Switching Speed 100% UIL Tested Synchronous Rectification for ATX / Server / Telecom PSU RoHS Compliant Battery Protection Circuit DC motor Drives and Uninterruptible Power Supplies Micro Solar Inverte D G G D S TO-220 S o MOSFET Maximum Ratings T = 25 C unless otherwise noted. C Symbol Parameter FDP023N08B F102 Unit V Drain to Source Voltage 75 V DSS V Gate to Source Voltage 20 V GSS o - Continuous (T = 25 C, Silicon Limited) 242* C o I Drain Current - Continuous (T = 100 C, Silicon Limited) 171* A D C o - Continuous (T = 25 C, Package Limited) 120 C I Drain Current - Pulsed (Note 1) 968 A DM E Single Pulsed Avalanche Energy (Note 2) 961 mJ AS dv/dt Peak Diode Recovery dv/dt (Note 3) 6 V/ns o (T = 25 C) 245 W C P Power Dissipation D o o - Derate Above 25C1.64W/ C o T , T Operating and Storage Temperature Range -55 to +175 C J STG o Maximum Lead Temperature for Soldering, 1/8 from Case for 5 Seconds T 300 C L * Package limitation current is 120A. Thermal Characteristics Symbol Parameter FDP023N08B F102 Unit R Thermal Resistance, Junction to Case, Max. 0.61 JC o C/W R Thermal Resistance, Junction to Ambient, Max. 62.5 JA 2013 Fairchild Semiconductor Corporation www.fairchildsemi.com 1 FDP023N08B Rev. C3