Is Now Part of To learn more about ON Semiconductor, please visit our website at www.onsemi.com Please note: As part of the Fairchild Semiconductor integration, some of the Fairchild orderable part numbers will need to change in order to meet ON Semiconductors system requirements. Since the ON Semiconductor product management systems do not have the ability to manage part nomenclature that utilizes an underscore ( ), the underscore ( ) in the Fairchild part numbers will be changed to a dash (-). This document may contain device numbers with an underscore ( ). Please check the ON Semiconductor website to verify the updated device numbers. The most current and up-to-date ordering information can be found at www.onsemi.com. Please email any questions regarding the system integration to Fairchild questions onsemi.com. ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductors product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. Typical parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals must be validated for each customer application by customers technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.FSLV16211 24-Bit Bus Switch October 2010 FSLV16211 24-Bit Bus Switch Features Description The FSLV16211 is a 24-bit, high-speed, low-voltage 5 Switch Connection between Two Ports bus switch. The low on resistance of the switch allows Minimal Propagation Delay through the Switch inputs to be connected to outputs without adding propagation delay or generating additional ground Low l CC bounce noise. Zero Bounce in Flow-Through Mode This design can be used as a 12- or 24-bit bus switch. Packaged in Thin-Shrink Small Outline Package When /OE1 is LOW, port 1A is connected to Port 1B. (TSSOP) When /OE2 is LOW, port 2A is connected to Port 2B. Ordering Information Operating Part Number Temperature Package Packing Method Range 56-Lead, Thin Shrink Small Outline Package FSLV16211MTDX -40C to 85C Tape and Reel (TSSOP), JEDEC M0-153, 6.1mm Wide 1A 1B 1 1 1A 1B 12 12 /OE 1 2A 2B 1 1 2A 2B 12 12 /OE 2 Figure 1. Logic Diagram 2003 Fairchild Semiconductor Corporation www.fairchildsemi.com FSLV16211 Rev. 1.0.2