LE25U20AQG CMOS IC 2M-bit (256K x 8) www.onsemi.com Serial Flash Memory Overview The LE25U20AQG is a serial interface-compatible flash memory device with a 256K 8-bit configuration. It uses a single 2.5V power supply. While making the most of the features inherent to a serial flash memory device, the LE25U20AQG is housed in an 8-pin ultra-miniature package. These features make this device ideally suited to storing program codes in applications such as portable information devices, which are required to have increasingly more compact dimensions. Moreover, by using the small sector erase function this product is also suitable for the parameter or the WDFN8 2x3 date storage usage with comparatively little rewriting times that becomes a capacity shortage in EEPROM. Features Read / write operations enabled by single 2.5V power supply: 2.30 to 3.60V supply voltage range Operating frequency : 30MHz Temperature range : 40 to 85C Serial interface : SPI mode 0, mode 3 supported Sector size : 4K bytes/small sector, 64K bytes/sector Small sector erase, sector erase, chip erase functions Page program function (256 bytes / page) Block protect function Status functions : Ready/busy information, protect information Highly reliable read/write Number of rewrite times : 100,000 times Small sector erase time : 40ms (typ.), 150ms (max.) Sector erase time : 80ms (typ.), 250ms (max.) Chip erase time : 250ms (typ.), 1.6s (max.) Page program time : 4.0ms/256 bytes (typ.), 5.0ms/256 bytes (max.) Data retention period : 20 years Package : WDFN8 23 * This product is licensed from Silicon Storage Technology, Inc. (USA). ORDERING INFORMATION See detailed ordering and shipping information on page 21 of this data sheet. Semiconductor Components Industries, LLC, 2014 1 Publication Order Number : October 2014 - Rev. 1 LE25U20AQG/D LE25U20AQG Package Dimensions unit : mm WDFN8 2x3, 0.5P CASE 511BY ISSUE O NOTES: A B D L L 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED L1 TERMINAL AND IS MEASURED BETWEEN DETAIL A 0.15 AND 0.25MM FROM THE TERMINAL TIP. 4. COPLANARITY APPLIES TO THE EXPOSED ALTERNATE E CONSTRUCTIONS PAD AS WELL AS THE TERMINALS. PIN ONE REFERENCE MILLIMETERS DIM MIN MAX EXPOSED Cu MOLD CMPD 0.10 C A 0.70 0.80 A1 0.00 0.05 A3 0.20 REF 0.10 C b 0.20 0.30 TOP VIEW D 2.00 BSC DETAIL B D2 1.40 1.60 DETAIL B A ALTERNATE E 3.00 BSC 0.10 C CONSTRUCTIONS E2 1.80 2.00 A3 e 0.50 BSC L 0.25 0.35 L1 0.15 0.08 C A1 SEATING NOTE 4 C GENERIC SIDE VIEW PLANE MARKING DIAGRAM* M 0.10 C A B 1 XXXXX DETAIL A D2 L AWLYW 1 4 M 0.10 C A B XXXXX = Specific Device Code A = Assembly Location WL = Wafer Lot E2 Y = Year W = Work Week = PbFree Package 8 5 8X b *This information is generic. Please refer to device data sheet for actual part marking. e M 0.10 C A B 0.05 M C NOTE 3 BOTTOM VIEW RECOMMENDED SOLDERING FOOTPRINT* 1.66 8X 0.50 2.04 3.30 1 8X 0.32 0.50 PITCH DIMENSIONS: MILLIMETERS *For additional information on our PbFree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Figure 1 Pin Assignments 1 2 3 4 8 7 6 5 Bottom View www.onsemi.jp 2 V CS DD HOLD SO SCK WP SI V SS