Single, Dual, Quad Low-Voltage, Rail-to-Rail Operational Amplifiers LMV321, NCV321, LMV358, LMV324 www.onsemi.com The LMV321, LMV321I, NCV321, LMV358/LMV358I and LMV324 are CMOS single, dual, and quad low voltage operational amplifiers with railtorail output swing. These amplifiers are a 5 1 costeffective solution for applications where low power consumption 1 SC70 and space saving packages are critical. Specification tables are TSOP5 CASE 419A provided for operation from power supply voltages at 2.7 V and 5 V. CASE 483 Rail to Rail operation provides improved signal to noise preformance. Ultra low quiescent current makes this series of amplifiers ideal for portable, battery operated equipment. The 1 Micro8 common mode input range includes ground making the device useful CASE 846A for low side currentshunt measurements. The ultra small packages allow for placement on the PCB in close proximity to the signal source 8 8 thereby reducing noise pickup. 1 1 Features UDFN8 SOIC8 Operation from 2.7 V to 5.0 V SingleSided Power Supply CASE 517AJ CASE 751 LMV321 Single Available in Ultra Small 5 Pin SC70 Package No Output Crossover Distortion RailtoRail Output 1 1 Low Quiescent Current: LMV358 Dual 220 A, Max per Channel SOIC14 TSSOP14 No Output PhaseReversal from Overdriven Input CASE 751A CASE 948G NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements AECQ100 ORDERING AND MARKING INFORMATION Qualified and PPAP Capable See detailed ordering and shipping information in the package These Devices are PbFree, Halogen Free/BFR Free and are RoHS dimensions section on page 12 of this data sheet. Compliant Typical Applications Notebook Computers and PDAs Portable BatteryOperated Instruments Active Filters Semiconductor Components Industries, LLC, 2015 1 Publication Order Number: January, 2021 Rev. 16 LMV321/DLMV321, NCV321, LMV358, LMV324 MARKING DIAGRAMS SC70 TSOP5 Micro8 8 5 V358 3ACAYW AAC M AYW 1 1 AAC = Specific Device Code 3AC = Specific Device Code V358 = Specific Device Code M = Date Code A = Assembly Location A = Assembly Location = PbFree Package Y = Year Y = Year W = Work Week W = Work Week (Note: Microdot may be in either location) = PbFree Package = PbFree Package (Note: Microdot may be in either location) (Note: Microdot may be in either location) SOIC8 UDFN8 8 V358 AC M ALYW 1 V358 = Specific Device Code AC = Specific Device Code A = Assembly Location M = Date Code L = Wafer Lot = PbFree Package Y = Year W = Work Week = PbFree Package SOIC14 TSSOP14 14 14 LMV LMV324 324 AWLYWWG ALYW 1 1 LMV324 = Specific Device Code LMV324 = Specific Device Code A = Assembly Location A = Assembly Location WL = Wafer Lot L = Wafer Lot Y = Year Y = Year WW = Work Week W = Work Week G = PbFree Package = PbFree Package PIN CONNECTIONS SC705/TSOP5 UDFN8/Micro8/SOIC8 SOIC14 TSSOP14 OUT A 1 14 OUT D OUT A 1 14 OUT D OUT A V+ 1 5 1 8 A D A D IN A 2 13 IN D IN A 2 13 IN D + + + + + +IN V A 3 12 IN D+ 3 12 IN D+ IN A+ IN A+ 2 + IN A OUT B 2 7 + V V+ 4 11 V V+ 4 11 V IN A+ IN B 3 4 3 6 10 IN C+ 10 IN C+ IN B+ 5 IN B+ 5 B IN OUTPUT + 9 9 IN C IN C IN B 6 IN B 6 V IN B+ 4 5 B C B C 8 OUT C 8 OUT C 7 7 OUT B OUT B (Top View) (Top View) (Top View) (Top View) www.onsemi.com 2 + + + +