MC74AC00, MC74ACT00
Quad 2-Input NAND Gate
HighPerformance SiliconGate CMOS
Features
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Output Drive Capability: 24 mA
Operating Voltage Range: 2 to 6 V AC00; 4.5 to 5.5 ACT00
MARKING
Low Input Current: 1.0A
DIAGRAMS
High Noise Immunity Characteristic of CMOS Devices
14
In Compliance With the JEDEC Standard No. 7A Requirements
Chip Complexity: 32 FETs
SOIC14
xxx00G
D SUFFIX
These are PbFree Devices
AWLYWW
CASE 751A
14
1
1
A1
1
3
Y1
2
B1
14
4
A2
6
xxx
Y2
5
TSSOP14
00
B2
DT SUFFIX ALYW
Y = AB
1
9
CASE 948G
A3
8
14
Y3
10
B3
1
12
A4
11 xxx = AC or ACT
Y4
13
A = Assembly Location
B4
WL or L = Wafer Lot
PIN 14 = V Y = Year
CC
PIN 7 = GND
WW or W = Work Week
G or = PbFree Package
Figure 1. Logic Diagram
(Note: Microdot may be in either location)
V B4 A4 Y4 B3 A3 Y3
CC
14 13 12 11 10 9 8
FUNCTION TABLE
Inputs Output
AB Y
L L H
L H H
H L H
1 2 3 4567
H H L
A1 B1 Y1 A2 B2 Y2 GND
Figure 2. Pinout: 14Lead Packages (Top View)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
Semiconductor Components Industries, LLC, 2015
1 Publication Order Number:
January, 2015 Rev. 10 MC74AC00/DMC74AC00, MC74ACT00
MAXIMUM RATINGS
Symbol Parameter Value Unit
V DC Supply Voltage 0.5 to 7.0 V
CC
V DC Input Voltage 0.5 V V 0.5 V
I I CC
V DC Output Voltage (Note 1) 0.5 V V 0.5 V
O O CC
I DC Input Diode Current 20 mA
IK
I DC Output Diode Current 50 mA
OK
I DC Output Sink/Source Current 50 mA
O
I DC Supply Current per Output Pin 50 mA
CC
I DC Ground Current per Output Pin 50 mA
GND
T Storage Temperature Range 65 to 150 C
STG
T Lead temperature, 1 mm from Case for 10 Seconds 260 C
L
T Junction temperature under Bias 150 C
J
Thermal Resistance (Note 2) SOIC 125 C/W
JA
TSSOP 170
P Power Dissipation in Still Air at 85C SOIC 125 mW
D
TSSOP 170
MSL Moisture Sensitivity Level 1
F Flammability Rating Oxygen Index: 30% 35% UL 94 V0 @ 0.125 in
R
V ESD Withstand Voltage Human Body Model (Note 3) > 2000 V
ESD
Machine Model (Note 4) > 200
Charged Device Model (Note 5) > 1000
I LatchUp Performance Above V and Below GND at 85C (Note 6) 100 mA
LatchUp CC
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. I absolute maximum rating must be observed.
O
2. The package thermal impedance is calculated in accordance with JESD517.
3. Tested to EIA/JESD22A114A.
4. Tested to EIA/JESD22A115A.
5. Tested to JESD22C101A.
6. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Min Typ Max Unit
V Supply Voltage MC74AC00 2.0 5.0 6.0 V
CC
MC74ACT00 4.5 5.0 5.5
V , V DC Input Voltage, Output Voltage (Ref. to GND) 0 V V
in out CC
t , t Input Rise and Fall Time (Note 7) V @ 3.0 V 150 ns/V
r f CC
MC74AC00 V @ 4.5 V 40
CC
V @ 5.5 V 25
CC
t , t Input Rise and Fall Time (Note 8) V @ 4.5 V 10 ns/V
r f CC
MC74ACT00 V @ 5.5 V 8.0
CC
T Junction Temperature 150 C
J
T Operating Ambient Temperature Range 55 25 125 C
A
I Output Current High 24 mA
OH
I Output Current Low 24 mA
OL
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
7. V from 30% to 70% V .
in CC
8. V from 0.8 V to 2.0 V.
in
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