MC74HC374A
Octal 3-State Non-Inverting
D Flip-Flop
HighPerformance SiliconGate CMOS
The MC74HC374A is identical in pinout to the LS374. The device
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inputs are compatible with standard CMOS outputs; with pullup
resistors, they are compatible with LSTTL outputs.
Data meeting the setup time is clocked to the outputs with the rising
edge of the clock. The Output Enable input does not affect the states of
the flipflops, but when Output Enable is high, the outputs are forced
SOIC20 TSSOP20
DW SUFFIX DT SUFFIX
to the highimpedance state; thus, data may be stored even when the
CASE 751D CASE 948E
outputs are not enabled.
The HC374A is identical in function to the HC574A which has the
PIN ASSIGNMENT
input pins on the opposite side of the package from the output. This
OUTPUT
device is similar in function to the HC534A which has inverting
ENABLE 1 V
20
CC
outputs.
Q0 2 Q7
19
D0 3 D7
18
Features
D1 4 D6
17
Output Drive Capability: 15 LSTTL Loads
5
Q1 16 Q6
6
Q2 15 Q5
Outputs Directly Interface to CMOS, NMOS, and TTL
D2 7 14 D5
Operating Voltage Range: 2.0 to 6.0 V
8
D4
D3 13
Low Input Current: 1.0 A 9 Q4
Q3 12
10 CLOCK
GND 11
High Noise Immunity Characteristic of CMOS Devices
In Compliance with the Requirements Defined by JEDEC Standard
MARKING DIAGRAMS
No. 7 A
20
20
Chip Complexity: 266 FETs or 66.5 Equivalent Gates
HC
NLV Prefix for Automotive and Other Applications Requiring
HC374A
374A
AWLYYWWG
Unique Site and Control Change Requirements; AECQ100
ALYW
Qualified and PPAP Capable
1
1
These Devices are PbFree and are RoHS Compliant
SOIC20 TSSOP20
A = Assembly Location
LOGIC DIAGRAM
WL, L = Wafer Lot
YY, Y = Year
2
3
Q0
D0
WW, W = Work Week
5
4
G or = PbFree Package
Q1
D1
(Note: Microdot may be in either location)
7 6
D2 Q2
8
9 FUNCTION TABLE
DATA D3
Q3
NONINVERTING
INPUTS 13
12 Inputs Output
D4 OUTPUTS
Q4
14 Output
D5 15
Q5
Enable Clock D Q
17
D6
16
LHH
Q6
18
D7
LLL
19
Q7
L L,H, X No Change
11
CLOCK
HX X Z
X = dont care
PIN 20 = V
CC
Z = high impedance
PIN 10 = GND
1
OUTPUT ENABLE
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
Semiconductor Components Industries, LLC, 2014
1 Publication Order Number:
October, 2017 Rev. 15 MC74HC374A/DMC74HC374A
MAXIMUM RATINGS
Symbol Parameter Value Unit
This device contains protection
circuitry to guard against damage
V DC Supply Voltage (Referenced to GND) 0.5 to +7.0 V
CC
due to high static voltages or electric
V DC Input Voltage (Referenced to GND) 0.5 to V + 0.5 V
in CC fields. However, precautions must
be taken to avoid applications of any
V DC Output Voltage (Referenced to GND) 0.5 to V + 0.5 V
out CC
voltage higher than maximum rated
I DC Input Current, per Pin 20 mA voltages to this highimpedance cir-
in
cuit. For proper operation, V and
in
I DC Output Current, per Pin 35 mA
out
V should be constrained to the
out
range GND (V or V ) V .
I DC Supply Current, V and GND Pins 75 mA
in out CC
CC CC
Unused inputs must always be
P Power Dissipation in Still Air, SOIC Package 500 mW
D
tied to an appropriate logic voltage
TSSOP Package 450
level (e.g., either GND or V ).
CC
Unused outputs must be left open.
T Storage Temperature 65 to +150 C
stg
T Lead Temperature, 1 mm from Case for 10 Seconds C
L
(SOIC, SSOP or TSSOP Package) 260
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of
these limits are exceeded, device functionality should not be assumed, damage may occur and
reliability may be affected.
Derating: SOIC Package: 7 mW/C from 65 to 125C
TSSOP Package: 6.1 mW/C from 65 to 125C
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Min Max Unit
V DC Supply Voltage (Referenced to GND) 2.0 6.0 V
CC
V , V DC Input Voltage, Output Voltage (Referenced to GND) 0 V V
in out CC
T Operating Temperature, All Package Types 55 +125 C
A
t , t Input Rise and Fall Time V = 2.0 V 0 1000 ns
r f CC
(Figure 1) V = 4.5 V 0 500
CC
V = 6.0 V 0 400
CC
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Guaranteed Limit
V 55 to
CC
V 25C 85C 125C
Symbol Parameter Test Conditions Unit
V Minimum HighLevel Input Voltage V = 0.1 V or V 0.1 V 2.0 1.50 1.50 1.50 V
IH out CC
|I | 20 A 3.0 2.10 2.10 2.10
out
4.5 3.15 3.15 3.15
6.0 4.20 4.20 4.20
V Maximum LowLevel Input Voltage V = 0.1 V or V 0.1 V 2.0 0.50 0.50 0.50 V
IL out CC
|I | 20 A 3.0 0.90 0.90 0.90
out
4.5 1.35 1.35 1.35
6.0 1.80 1.80 1.80
V Minimum HighLevel Output
V = V or V 2.0 1.90 1.90 1.90 V
OH in IH IL
Voltage 4.5 4.40 4.40 4.40
|I | 20 A
out
6.0 5.90 5.90 5.90
V = V or V |I | 2.4 mA 3.0 2.48 2.34 2.20
in IH IL out
|I | 6.0 mA 4.5 2.98 3.84 3.70 V
out
|I | 7.8 mA 6.0 5.48 5.34 5.20
out
V Maximum LowLevel Output
V = V or V 2.0 0.10 0.10 0.10 V
OL in IH IL
Voltage
|I | 20 A 4.5 0.10 0.10 0.10
out
6.0 0.10 0.10 0.10
V = V or V |I | 2.4 mA 3.0 0.26 0.33 0.40
in IH IL out
|I | 6.0 mA 4.5 0.26 0.33 0.40 V
out
|I | 7.8 mA 6.0 0.26 0.33 0.40
out
I Maximum Input Leakage Current V = V or GND 6.0 0.1 1.0 1.0 A
in in CC
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