MC78L00A Series, NCV78L00A 100 mA Positive Voltage Regulators The MC78L00A Series of positive voltage regulators are inexpensive, easytouse devices suitable for a multitude of MC78L00A Series, NCV78L00A MC78LXXA Input Output C * in C ** O 0.33 F 0.1 F Figure 2. Standard Application A common ground is required between the input and the output voltages. The input voltage must remain typically 2.0 V above the output voltage even during the low point on the input ripple voltage. * C is required if regulator is located an appreciable distance from power supply filter. in ** C is not needed for stability however, it does improve transient response. O ABSOLUTE MAXIMUM RATINGS Rating Symbol Value Unit Input Voltage (5.0 V9.0 V) V 30 Vdc I Input Voltage (12 V18 V) 35 Input Voltage (24 V) 40 Storage Temperature Range T 65 to +150 C stg Maximum Junction Temperature T 150 C J Moisture Sensitivity Level MSL 1 ESD Capability, Human Body Model (Note 1) ESD 2000 V HBM ESD Capability, Machine Model (Note 1) ESD 200 V MM ESD Capability, Charged Device Model (Note 1) ESD 2000 V CDM Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. This device series incorporates ESD protection and is tested by the following methods: ESD Human Body Model tested per AECQ100002 (EIA/JESD22A114) ESD Machine Model tested per AECQ100003 (EIA/JESD22A115) ESD Charged Device Model tested per EIA/JES D22/C101, Field Induced Charge Model. THERMAL CHARACTERISTICS Rating Symbol Value Unit Package Dissipation PD Internally Limited W Thermal Characteristics, TO 92 R 200 C/W JA Thermal Resistance, JunctiontoAmbient Thermal Characteristics, SOIC8 R Refer to Figure 8 C/W JA Thermal Resistance, JunctiontoAmbient 2. Thermal Resistance, JunctiontoAmbient depends on P.C.B. Copper area. See details in Figure 8. Thermal Resistance, JunctiontoCase is not defined. SOIC 8 lead and TO-92 packages that do not have a heat sink like other packages may have. This is the reason that a Theta JC is never specified. A little heat transfer will occur through the package but since it is plastic, it is minimal. The majority of the heat that is transferred is through the leads where they connect to the circuit board.