DATA SHEET www.onsemi.com Zener Voltage Regulators 500 mW SOD123 Surface Mount SOD123 CASE 425 MMSZ52xxxT1G Series, STYLE 1 SZMMSZ52xxxT1G Series 1 2 Three complete series of Zener diodes are offered in the convenient, Cathode Anode surface mount plastic SOD123 package. These devices provide aconvenient alternative to the leadless 34package style. Zener MARKING DIAGRAM voltage in this series are specified with device junction in thermal equilibrium. xx M Features 1 500 mW Rating on FR4 or FR5 Board Wide Zener Reverse Voltage Range 2.4 V to 110 V Thermal Equilibrium* xx = Device Code (Refer to page 3) Package Designed for Optimal Automated Board Assembly M = Date Code = PbFree Package Small Package Size for High Density Applications (Note: Microdot may be in either location) General Purpose, Medium Current ESD Rating of Class 3 (> 16 kV) per Human Body Model ORDERING INFORMATION SZ Prefix for Automotive and Other Applications Requiring Unique Device Package Shipping Site and Control Change Requirements AECQ101 Qualified and PPAP Capable MMSZ52xxBT1G, SOD123 3,000 / SZMMSZ52xxBT1G (PbFree) Tape & Reel These are PbFree Devices MMSZ52xxCT1G, SOD123 3,000 / SZMMSZ52xxCT1G Mechanical Characteristics: (PbFree) Tape & Reel CASE: Void-free, transfer-molded, thermosetting plastic case MMSZ52xxBT3G, SOD123 10,000 / FINISH: Corrosion resistant finish, easily solderable SZMMSZ52xxBT3G (PbFree) Tape & Reel MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: MMSZ52xxCT3G, SOD123 10,000 / 260C for 10 Seconds SZMMSZ52xxCT3G (PbFree) Tape & Reel POLARITY: Cathode indicated by polarity band For information on tape and reel specifications, FLAMMABILITY RATING: UL 94 V0 including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. MAXIMUM RATINGS Rating Symbol Max Units DEVICE MARKING INFORMATION Total Power Dissipation on FR5 Board, P D See specific marking information in the device marking (Note 1) T = 75C 500 mW column of the Electrical Characteristics table on page 3 of L Derated above 75C 6.7 mW/C this data sheet. Thermal Resistance, JunctiontoAmbient R 340 C/W JA (Note 2) Thermal Resistance, JunctiontoLead R 150 C/W JL (Note 2) Junction and Storage Temperature Range T , T 55 to +150 C J stg Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. FR5 = 3.5 X 1.5 inches, using the minimum recommended footprint. 2. Thermal Resistance measurement obtained via infrared Scan Method. *For additional info on thermal equilibrium, please download, onsemi TVS/Zener Theory and Design Considerations Handbook, HBD854/D. Semiconductor Components Industries, LLC, 2015 1 Publication Order Number: August, 2021 Rev. 16 MMSZ5221BT1/DMMSZ52xxxT1G Series, SZMMSZ52xxxT1G Series ELECTRICAL CHARACTERISTICS (T = 25C unless A I otherwise noted, V = 0.95 V Max. I = 10 mA) F F I F Symbol Parameter V Reverse Zener Voltage I Z ZT I Reverse Current ZT V V Z Maximum Zener Impedance I Z R ZT ZT V I V R F I Reverse Current I ZK ZT Z Maximum Zener Impedance I ZK ZK I Reverse Leakage Current V R R V Reverse Voltage R I Forward Current F V Forward Voltage I Zener Voltage Regulator F F www.onsemi.com 2
