NBXDBB017, NBXDBA017, NBXHBA017, NBXSBA017 3.3 V, 156.25 MHz / 312.5 MHz LVPECL Clock Oscillator NBXDBB017, NBXDBA017, NBXHBA017, NBXSBA017 1 6 1 6 OE V OE V DD DD FSEL 2 5 CLK NC 2 5 CLK GND 3 4 CLK GND 3 4 CLK NBXDBA017/NBXDBB017 NBXSBA017/NBXHBA017 Figure 2. Pin Connections (Top View) Table 1. PIN DESCRIPTION Pin No. Symbol I/O Description 1 OE LVTTL/LVCMOS Output Enable Pin. When left floating pin defaults to logic HIGH and output is active. Control Input See OE pin description Table 2. 2 FSEL/ LVTTL/LVCMOS Output Frequency Select Pin. Pin will default to logic HIGH when left open. See Output NC* Control Input Frequency Select pin description Table 3. 3 GND Power Supply Ground 0 V 4 CLK LVPECL Output NonInverted Clock Output. Typically loaded with 50 receiver termination resistor to V = V 2 V. TT DD 5 CLK LVPECL Output Inverted Clock Output. Typically loaded with 50 receiver termination resistor to V = V 2 V. TT DD 6 V Power Supply Positive power supply voltage. Voltage should not exceed 3.3 V 10%. DD *NBXSBA017 and NBXHBA017 only. Table 2. OUTPUT ENABLE TRISTATE FUNCTION Table 3. OUTPUT FREQUENCY SELECT OE Pin Output Pins FSEL Pin Output Frequency (MHz) Open Active Open 156.25 (pin will float high) HIGH Level Active HIGH Level 156.25 LOW Level High Z LOW Level 312.5 Table 4. ATTRIBUTES Characteristic Value Input Default State Resistor 170 k ESD Protection Human Body Model 2 kV Machine Model 200 V Meets or Exceeds JEDEC Standard EIA/JESD78 IC Latchup Test 1. For additional Moisture Sensitivity information, refer to Application Note AND8003/D. Table 5. MAXIMUM RATINGS Symbol Parameter Condition 1 Condition 2 Rating Units V Positive Power Supply GND = 0 V 4.6 V DD I LVPECL Output Current Continuous 25 mA out Surge 50 T Operating Temperature Range 40 to +85 C A T Storage Temperature Range 55 to +120 C stg T Wave Solder See Figure 6 260 C sol Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.