DATA SHEET www.onsemi.com MARKING TinyLogic ULP-A DIAGRAMS Exclusive-OR Gate SIP6 1.45X1.0 CCKK MicroPak XYZ CASE 127EB NC7SP86 Pin 1 The NC7SP86 is a single 2input exclusiveOR gate in tiny = CC = Specific Device Code footprint packages. The device is designed to operate for V 0.9 V CC KK = 2Digit Lot Run Traceability Code to 3.6 V. XY = 2Digit Date Code Z = Assembly Plant Code Features Designed for 0.9 V to 3.6 V V Operation CC 2.2 ns t at 3.3 V (Typ) SC88A PD XXXM CASE 419A02 Inputs/Outputs OverVoltage Tolerant up to 3.6 V I Supports Partial Power Down Protection OFF Source/Sink 2.6 mA at 3.3 V XXX = Specific Device Code Available in SC88A and MicroPak Packages M = Date Code = PbFree Package These Devices are PbFree, Halogen Free/BFR Free and are RoHS Compliant ORDERING INFORMATION See detailed ordering, marking and shipping information on page 6 of this data sheet. A 1 6 V CC A 1 5 V CC B 2 5 NC B 2 GND 3 4 Y GND 3 4 Y SC88A MicroPak Figure 1. Pinout Diagrams (Top Views) A = 1 Y B Figure 2. Logic Symbol PIN ASSIGNMENT FUNCTION TABLE Pin SC88A MicroPak Input Output 1 A A A B Y 2 B B L L L 3 GND GND L H H 4 Y Y H L H 5 V N.C. H H L CC 6 V CC N.C. = No Connect Semiconductor Components Industries, LLC, 2021 1 Publication Order Number: November, 2021 Rev. 0 NC7SP86/DNC7SP86 MAXIMUM RATINGS Symbol Characteristics Value Unit V DC Supply Voltage 0.5 to +4.3 V CC V DC Input Voltage 0.5 to +4.3 V IN V DC Output Voltage ActiveMode (High or Low State) 0.5 to V + 0.5 V OUT CC TriState Mode (Note 1) 0.5 to +4.3 PowerDown Mode (V = 0 V) 0.5 to +4.3 CC I DC Input Diode Current V < GND 50 mA IK IN I DC Output Diode Current V < GND 50 mA OK OUT I DC Output Source/Sink Current 50 mA OUT I or I DC Supply Current per Supply Pin or Ground Pin 50 mA CC GND T Storage Temperature Range 65 to +150 C STG T Lead Temperature, 1 mm from Case for 10 Seconds 260 C L T Junction Temperature Under Bias +150 C J Thermal Resistance (Note 2) SC88A 377 C/W JA MicroPak 154 P Power Dissipation in Still Air SC88A 332 mW D MicroPak 812 MSL Moisture Sensitivity Level 1 F Flammability Rating Oxygen Index: 28 to 34 UL 94 V0 0.125 in R V ESD Withstand Voltage (Note 3) Human Body Model 2000 V ESD Charged Device Model 1000 I Latchup Performance (Note 4) 100 mA Latchup Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Applicable to devices with outputs that may be tristated. 2. Measured with minimum pad spacing on an FR4 board, using 10 mmby1 inch, 2 ounce copper trace no air flow per JESD517. 3. HBM tested to EIA / JESD22A114A. CDM tested to JESD22C101A. JEDEC recommends that ESD qualification to EIA/JESD22A115A (Machine Model) be discontinued. 4. Tested to EIA/JESD78 Class II. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Unit V Positive DC Supply Voltage 0.9 3.6 V CC V DC Input Voltage 0 3.6 V IN V DC Output Voltage ActiveMode (High or Low State) 0 V OUT CC TriState Mode (Note 1) 0 3.6 PowerDown Mode (V = 0 V) 0 3.6 CC T Operating Temperature Range 40 +85 C A t , t Input Transition Rise and Fall Time V = 3.3 V 0.3 V 0 10 ns/V r f CC Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. www.onsemi.com 2