12-Bit Low Power SAR ADC NCD98010, NCD98011 The NCD98010 (unsigned output) and the NCD98011 (signed output) ADC products provide an extremely low power solution for analog to digital conversion applications using a capacitorbased successiveapproximation architecture. Optimized for low power and speed, the NCD98010/1 can achieve a sample rate of 2 MSPS while www.onsemi.com consuming less than 1 mW of power. The device also features a large input voltage range of 1.65 V to 3.3 V for various applications for both analog and digital supplies. The SPIcompatible interface provides a MARKING straightforward dataacquisition method. DIAGRAMS Features X2QFN8 DP SUFFIX XXM Nanowatt Power Consumption CASE 722AM Fully Differential Input 2MSPS Throughput Small Package Size US8 (SSOP8) XXM MX SUFFIX PreCalibrated CASE 493 SPI Interface XX = Specific Device Code These Devices are PbFree, Halogen Free/BFR Free and are RoHS M = Date Code Compliant Typical Applications PIN CONFIGURATION LowPower Data Acquisition V INN Batterypowered Equipment 8 CSN V 1 7 INP Level Sensors OUT 2 6 V Ultrasonic Flow Meters CC Motor Controls CLK GND 3 5 4 Wearable Fitness V DD Portable Medical Equipment X2QFN8 (Top View) Glucose Meters V GND 1 8 DD V V CC DD CLK 2 7 V CC OUT V 3 6 INP + CSN V 4 5 V INN INP CSN Switched Capacitive Comparator US8 (Top View) DAC V INN - Serial CLK Interface ORDERING INFORMATION Device Package Shipping Successive Approximation Register OUT NCD98010XMXTAG Digital Control X2QFN NCD98011XMXTAG 5000 / Tape & Reel NCD98010XDPT3G* SSOP8 GND NCD98011XDPT3G* Figure 1. Block Diagram For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. * These products are currently under development. Please contact Sales regarding their availability. Semiconductor Components Industries, LLC, 2020 1 Publication Order Number: October, 2020 Rev. 2 NCD9801/DNCD98010, NCD98011 PIN DESCRIPTION X2QFN SSOP Pin No. Pin No. Name Function 1 4 CSN Chip select (active low) 2 3 OUT Data Output (serialized) 3 2 CLK Clock 4 1 VDD Digital I/O supply voltage 5 8 GND Common ground for all pins 6 7 VCC Analog supply and ADC reference voltage 7 6 V Analog input, positive signal INP 8 5 V Analog input, negative signal INN MAXIMUM RATINGS Rating Symbol Value Unit Supply Voltage Range V 0.3 to 3.63 V CC Supply Voltage Range V 0.3 to 3.63 V DD Input Voltage Range V 0.3 to 3.63 V INP Input Voltage Range V 0.3 to 3.63 V INN Output Voltage Range V 0.3 to 3.63 V OUT CSN Input Voltage Range V 0.3 to 3.63 V EN Storage Temperature Range T 40 to 150 C STG Lead Temperature, Soldering (10 sec.) T 260 C SLD ESD Capability, Human Body Model (Note 1) ESD 2.0 kV HBM ESD Capability, Charged Device Model (Note 1) ESD 500 V CDM Latchup Current Immunity (Note 1) LU 100 mA Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Tested by the following methods T = 25C: A ESD Human Body Model tested per JESD22 A114 ESD Charged Device Model per ESD STM5.3.1 Latchup Current tested per JESD78. RECOMMENDED OPERATING CONDITIONS Rating Symbol Min Max Unit Analog Supply Voltage V 1.65 3.6 V CC Digital I/O Supply Voltage V 1.65 3.6 V DD Ground GND 0 V Ambient Temperature T 40 120 C A Junction Temperature T 40 125 C J Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. www.onsemi.com 2