LDO Regulator - UltraLow I , CMOS Q 150 mA NCP170 The NCP170 series of CMOS low dropout regulators are designed specifically for portable battery-powered applications which require www.onsemi.com ultra-low quiescent current. The ultra-low consumption of typ. 500 nA ensures long battery life and dynamic transient boost feature improves device transient response for wireless communication applications. The device is available in small 1 1 mm XDFN4, SOT-563 and 6 5 TSOP-5 packages. 1 1 1 XDFN4 SOT563 TSOP5 Features MX SUFFIX XV SUFFIX SN SUFFIX Operating Input Voltage Range: 2.2 V to 5.5 V CASE 711AJ CASE 463A CASE 483 Output Voltage Range: 1.2 V to 3.6 V (0.1 V Steps) Ultra-Low Quiescent Current Typ. 0.5 A MARKING DIAGRAMS Low Dropout: 170 mV Typ. at 150 mA XDFN4 High Output Voltage Accuracy 1% Stable with Ceramic Capacitors 1 F XX M Over-Current Protection 1 XX = Specific Device Code Thermal Shutdown Protection M = Date Code NCP170A for Active Discharge Option Available in Small 1 1 mm XDFN4, SOT563 and TSOP-5 SOT563 Packages These Devices are PbFree, Halogen Free/BFR Free and are RoHS XX M Compliant 1 XX = Specific Device Code Typical Applications M = Month Code Battery Powered Equipments = Pb-Free Package *Pb-Free indicator, G or microdot , Portable Communication Equipments may or may not be present. Cameras, Image Sensors and Camcorders TSOP5 5 V V IN OUT IN OUT XXXAYW NCP170 C 1 F1EN C F IN OUT 1 GND XXX = Specific Device Code A = Assembly Location Y = Year W = Work Week = PbFree Package Figure 1. Typical Application Schematic (Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering, marking and shipping information on page 22 of this data sheet. Semiconductor Components Industries, LLC, 2017 1 Publication Order Number: December, 2020 Rev. 23 NCP170/DNCP170 PIN FUNCTION DESCRIPTION Pin No. Pin No. Pin No. XDFN4 SOT563 TSOP5 Pin Name Description 4 1 1 IN Power Supply Input Voltage 2 2 2 GND Power Supply Ground 3 6 3 EN Chip Enable Pin (Active H) 1 3 5 OUT Output Pin EPAD EPAD Internally Connected to GND 4 4 NC No Connect 5 GND Power Supply Ground ABSOLUTE MAXIMUM RATINGS Symbol Rating Value Unit V Input Voltage (Note 1) 6.0 V IN V Output Voltage 0.3 to V + 0.3 V OUT IN V Chip Enable Input 0.3 to 6.0 V CE T Maximum Junction Temperature 150 C J(MAX) T Storage Temperature 55 to 150 C STG ESD ESD Capability, Human Body Model (Note 2) 2000 V HBM ESD ESD Capability, Machine Model (Note 2) 200 V MM Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area. 2. This device series incorporates ESD protection and is tested by the following methods: ESD Human Body Model tested per AEC-Q100-002 (EIA/JESD22-A114) ESD Machine Model tested per AEC-Q100-003 (EIA/JESD22-A115) Latchup Current Maximum Rating tested per JEDEC standard: JESD78 THERMAL CHARACTERISTICS Symbol Rating Value Unit R Thermal Characteristics, Thermal Resistance, Junction-to-Air C/W JA XDFN4 1 1mm 250 SOT563 200 TSOP5 250 Figure 2. Simplified Block Diagram www.onsemi.com 2