LDO Regulator - Fast Transient Response, Low Voltage 500 mA NCP176 www.onsemi.com The NCP176 is CMOS LDO regulator featuring 500 mA output current. The input voltage is as low as 1.4 V and the output voltage can be set from 0.7 V. Features XDFN6 Operating Input Voltage Range: 1.4 V to 5.5 V MX SUFFIX Output Voltage Range: 0.7 to 3.6 V (0.1 V steps) CASE 711AT Quiescent Current typ. 60 A Low Dropout: 130 mV typ. at 500 mA, V = 2.5 V OUT PIN CONNECTIONS High Output Voltage Accuracy 0.8% (V > 1.8 V) OUT Stable with Small 1 F Ceramic Capacitors OUT 1 6 IN Overcurrent Protection FB 2 5 N/C Builtin Soft Start Circuit to Suppress Inrush Current 3 4 GND EN Thermal Shutdown Protection: 165C With (NCP176A) and Without (NCP176B) Output Discharge XDFN6 (Top View) Function Available in XDFN6 1.2 mm x 1.2 mm x 0.4 mm Package MARKING DIAGRAM These are Pbfree Devices Typical Applications XX M Battery Powered Equipment Portable Communication Equipment XX = Specific Device Code Cameras, Image Sensors and Camcorders M = Date Code VIN VOUT IN OUT ORDERING INFORMATION CIN COUT NCP176 See detailed ordering and shipping information in the ordering 1 F ON 1 F information section on page 11 of this data sheet. EN FB GND OFF Figure 1. Typical Application Schematic Semiconductor Components Industries, LLC, 2015 1 Publication Order Number: June, 2021 Rev. 6 NCP176/D GNDNCP176 IN OUT IN OUT PROG. VOLTAGE PROG . VOLTAGE REFERENCE AND REFERENCE AND SOFT START SOFT START FB/ADJ FB/ADJ EN EN 0.7 V 0.7 V THERMAL THERMAL GND GND SHUTDOWN SHUTDOWN NCP176A (with output active discharge) NCP176B (without output active discharge) Figure 2. Internal Block Diagram Table 1. PIN FUNCTION DESCRIPTION Pin No. Pin XDFN6 Name Description 1 OUT LDO output pin 2 FB Feedback input pin 3 GND Ground pin 4 EN Chip enable input pin (active H) 5 N/C Not internally connected. This pin can be tied to the ground plane to improve thermal dissipation. 6 IN Power supply input pin EPAD EPAD It is recommended to connect the EPAD to GND, but leaving it open is also acceptable Table 2. ABSOLUTE MAXIMUM RATINGS Rating Symbol Value Unit Input Voltage (Note 1) IN 0.3 to 6.0 V Output Voltage OUT 0.3 to VIN + 0.3 V Chip Enable Input EN 0.3 to 6.0 V Output Current I Internally Limited mA OUT Maximum Junction Temperature T 150 C J(MAX) Storage Temperature T 55 to 150 C STG ESD Capability, Human Body Model (Note 2) ESD 2000 V HBM ESD Capability, Machine Model (Note 2) ESD 200 V MM Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area. 2. This device series incorporates ESD protection and is tested by the following methods: ESD Human Body Model tested per AECQ100002 (EIA/JESD22A114) ESD Machine Model tested per AECQ100003 (EIA/JESD22A115) Latchup Current Maximum Rating tested per JEDEC standard: JESD78 Table 3. THERMAL CHARACTERISTICS Rating Symbol Value Unit Thermal Resistance, JunctiontoAir, XDFN6 1.2 mm x 1.2 mm (Note 3) R 123 C/W JA 3. Measured according to JEDEC board specification. Detailed description of the board can be found in JESD51 7. www.onsemi.com 2