NCS2005SN1T1G ON Semiconductor

NCS2005 Operational Amplifier, Low Power, 8 MHz GBW, Rail-to-Rail Input-Output The NCS2005 provides high performance in a wide range of applications. The NCS2005 offers beyond railtorail input range, full www.onsemi.com railtorail output swing, large capacitive load driving ability, and low distortion. The inputs can be driven by voltages that exceed both power supply rails, thus eliminating concerns over exceeding the 5 common mode voltage range. The rail to rail output swing 1 capability provides the maximum possible dynamic range at the SOT235 output. This is particularly important when operating on low supply SN SUFFIX voltages. CASE 483 Operating on supplies of 2.2 V to 32 V, the NCS2005 is excellent for a very wide range of applications in low power systems. With a supply MARKING DIAGRAM current of 1.3 mA, the 8 MHz gainbandwidth of this device supports applications where faster speeds are required. Placing the amplifier 5 right at the signal source reduces board size and simplifies signal JFKAYW routing. The NCS2005 is available in a spacesaving 5pin SOT23 package. 1 Features JFK = Specific Device Code A = Assembly Location Wide Power Supply Range: 2.2 V to 32 V Y = Year Common Mode Voltage Range Wider than RailtoRail: W = Work Week V = 0.1 V to 5.1 V V = 5 V = PbFree Package CM S Wide Gainbandwidth: 8 MHz typical (Note: Microdot may be in either location) Low Supply Current: 1.3 mA typical Stable with a 1 nF Capacitor Load with a Phase Margin over 25 PIN DIAGRAM V = 10 V S Available in a Spacesaving 5pin SOT23 Package OUT 1 5 V+ These devices are Pbfree, Halogen free/BFR Free and are RoHS Compliant 2 V Typical Applications + Active Filters IN+ Voltage Referenced Buffers 3 4 IN Sensors and Instrumentation Microphone Amplifiers (Top View) ASIC Input Drivers Portable Communications ORDERING INFORMATION PCMCIA Cards Device Package Shipping NCS2005SN1T1G SOT23 3000 / Tape & (PbFree) Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. Semiconductor Components Industries, LLC, 2016 1 Publication Order Number: March, 2019 Rev. 2 NCS2005/DNCS2005 Table 1. PIN DESCRIPTION Pin Name Type Description 1 OUT Output Amplifier output 2 V Power Negative power supply 3 IN+ Input Noninverting input of amplifier 4 IN Input Inverting input of amplifier 5 V+ Power Positive power supply Table 2. ABSOLUTE MAXIMUM RATINGS (Note 1) rating Symbol Value Units Supply Voltage Range (V+ V) V 0 to 35 V S Input Voltage Range V (V) 0.3 V to (V+) + 0.3 V V CM Differential Input Voltage Range V 0 to 15 V diff Input Pin Current I 10 mA IN Output Pin Current (Note 2) I 20 mA OUT Supply Current I 25 mA s Maximum Junction Temperature (Note 3) T +150 C J(max) Storage Temperature Range T 65 to +150 C stg ESD Capability (Note 4) V Human Body Model HBM 4000 Charged Device Model CDM 400 Moisture Sensitivity Level (Note 5) MSL Level 1 Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area. 2. Applies to both single supply and split supply operation. Continuous short circuit operation at elevated ambient temperature can result in exceeding the maximum allowed junction temperature of 150C. 3. The maximum power dissipation is a function of T , T , and T . The maximum allowable dissipation at any ambient temperature is J(MAX) JA A P = (T T )/T . All numbers apply for packages soldered directly to a PC board. d J(max) A JA 4. This device series incorporates ESD protection and is tested by the following methods: ESD Human Body Model tested per JESD22 A114 ESD Charged Device Model tested per ANSI/ESD S5.3.1 2009 5. Moisture Sensitivity Level tested per IPC/JEDEC standard: JSTD020A Table 3. THERMAL CHARACTERISTICS Parameter Symbol Package Single Layer Board Multi Layer Board Units Thermal Resistance JunctiontoAmbient (Note 6) SOT235 408 (Note 6) 355 (Note 7) C/W JA 2 6. Values based on a 1S standard PCB according to JEDEC513 with 1.0 oz copper and a 300 mm copper area 2 7. Values based on a 1S2P standard PCB according to JEDEC517 with 1.0 oz copper and a 100 mm copper area Table 4. OPERATING RANGES Parameter Symbol Min Max Units Power Supply Voltage V 2.2 32 V S Common Mode Input Voltage V (V) 0.1 (V+) + 0.1 V CM Ambient Temperature T 40 125 C A Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. www.onsemi.com 2