NIS5135MN1TXG ON Semiconductor

NIS5135 Series +5 Volt Electronic Fuse The NIS5135 is a cost effective, resettable fuse which can greatly enhance the reliability of a hard drive or other circuit from both catastrophic and shutdown failures. It is designed to buffer the load device from excessive input voltage which can damage sensitive circuits. It also includes an overvoltage NIS5135 Series VCC Charge Enable Pump ENABLE/ FAULT SOURCE Current Thermal I LIMIT Limit Shutdown UVLO dv/dt dv/dt Voltage Control Clamp GND Figure 1. Block Diagram Table 1. FUNCTIONAL PIN DESCRIPTION Pin Function Description 1 5 Source This pin is the source of the internal power FET and the output terminal of the fuse. 7 I A resistor between this pin and the source pin sets the overload and short circuit current limit Limit levels. 8 Enable/Fault The enable/fault pin is a tri state, bidirectional interface. It can be used to enable or disable the output of the device by pulling it to ground using an open drain or open collector device. If a thermal fault occurs, the voltage on this pin will go to an intermediate state to signal a monitoring circuit that the device is in thermal shutdown. It can also be connected to another device in this family to cause a simultaneous shutdown during thermal events. 9 dv/dt The internal dv/dt circuit controls the slew rate of the output voltage at turn on. It has an internal capacitor that allows it to ramp up over a period of 2 ms. An external capacitor can be added to this pin to increase the ramp time. If an additional time delay is not required, this pin should be left open. 10 Ground Negative input voltage to the device. This is used as the internal reference for the IC. 11 (belly pad) V Positive input voltage to the device. CC MAXIMUM RATINGS Rating Symbol Value Unit Input Voltage, operating, steadystate (V to GND, Note 1) V 0.6 to 18 V CC IN 0.6 to 25 Transient (100 ms) Thermal Resistance, Junction toAir C/W JA 2 0.1 in copper (Note 2) 227 2 0.5 in copper (Note 2) 95 Thermal Resistance, Junction toLead (Pin 1) 27 C/W JL Thermal Resistance, JunctiontoCase 20 C/W JC Total Power Dissipation T = 25C P 1.3 W A max Derate above 25C 10.4 mW/C Operating Temperature Range (Note 3) T 40 to 150 C J Nonoperating Temperature Range T 55 to 155 C J Lead Temperature, Soldering (10 Sec) T 260 C L Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Negative voltage will not damage device provided that the power dissipation is limited to the rated allowable power for the package. 2. 1 oz copper, double sided FR4. 3. Thermal limit is set above the maximum thermal rating. It is not recommended to operate this device at temperatures greater than the maximum ratings for extended periods of time.