Product Information

NL3S325FCT2G

NL3S325FCT2G electronic component of ON Semiconductor

Datasheet
Switch ICs - Various AUDIO JACK GND MIC SWITCH

Manufacturer: ON Semiconductor
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
N/A

Obsolete
Availability Price Quantity
0 - WHS 1

MOQ : 1
Multiples : 1

Stock Image

NL3S325FCT2G
ON Semiconductor

1 : USD 0.8942
10 : USD 0.7856
100 : USD 0.5301
500 : USD 0.4411
1000 : USD 0.3663
3000 : USD 0.3194
9000 : USD 0.312
24000 : USD 0.3071
45000 : USD 0.2996
N/A

Obsolete
     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
On Resistance - Max
Supply Voltage - Max
Supply Voltage - Min
Maximum Operating Temperature
Minimum Operating Temperature
Minimum Operating Temperature
Packaging
Number of Switches
Configuration
Operating Supply Voltage
Package / Case
Mounting Style
Product
Brand
Off Time - Max
On Time - Max
Supply Current - Max
Cnhts
Hts Code
Mxhts
Product Type
Factory Pack Quantity :
Subcategory
Taric
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NL3S325 Audio Jack GND/MIC Configuration Switch The NL3S325 is an audio jack configuration switch device. It allows reconfiguration of the GND, microphonebias contact to comply with the American Headset Jack (AHJ) and the Open Mobile www.onsemi.com Terminal Platform (OMTP) pinout. It also provides a GND sense path that supports quasidifferential audio amplifier architectures. Features AHJ and OMTP Headset Jack Pinout Support WLCSP9 Wide V Range: 1.6 V to 3.7 V DD FC SUFFIX Low Supply Current CASE 567MD Sense Path to GND for Quasi Differential Audio Amplifier Configuration MARKING DIAGRAM Low THD and Noise Microphone Pass-through Channel Ultralow R of Ground and Sense Switches ON 325 High Power Supply Ripple Rejection AYWW ESD Performance: 8 kV HBM on SBUn, SENSEn, SENSE, V , GND DD 3 kV HBM on MIC, SEL 325 = Specific Device Code Available in 1.19 mm x 1.19 mm WLCSP9 A = Assembly Location Y = Year This Device is PbFree, Halogen Free/BFR Free and RoHS WW = Work Week Compliant = PbFree Package Applications (Note: Microdot may be in either location) Headsets with Integrated MIC and Remote Control Buttons USB TypeC Switching ORDERING INFORMATION Device Package Shipping NL3S325FCT2G WLCSP9 3000 / Tape & (PbFree) Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Semiconductor Components Industries, LLC, 2017 1 Publication Order Number: June, 2018 Rev. 1 NL3S325/DNL3S325 V DD SENSE2 SENSE SENSE1 MIC SBU2 SBU1 SEL RPD GND Figure 1. Block Diagram Table 1. FUNCTION TABLE V SEL Connections Mode DD 0 V X All I/O Ports HiZ Disabled 1.6 V to 3.6 V 0 SBU2=MIC SBU1=GND SENSE1=SENSE AHJ 1.6 V to 3.6 V 1 SBU1=MIC SBU2=GND SENSE2=SENSE OMTP SENSE1 SENSE SENSE2 A SBU2 SBU1 SEL B V GND MIC DD C 12 3 Figure 2. WLCSP9 Top Through View Table 2. PIN DESCRIPTIONS Pin Name Ball Description SENSE1 A1 Sense Path 1 to Headset Jack GND SENSE A2 Sense Path for GND Sensing SENSE2 A3 Sense Path 2 to Headset Jack GND SBU1 B1 USB TypeC SBU1 Connection SEL B2 Configuration Select SBU2 B3 USB TypeC SBU2 Connection V C1 Power Supply DD GND C2 Ground MIC C3 MIC Bias Path CODEC Side www.onsemi.com 2

Tariff Desc

8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
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FAIRCHILD
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ON
ON SEMI
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