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MOSFET - N-Channel Shielded Gate PowerTrench 150 V, 31 m , 31 A NTMFS034N15MC Features www.onsemi.com Small Footprint (5 x 6 mm) for Compact Design Low R to Minimize Conduction Losses DS(on) Low QG and Capacitance to Minimize Driver Losses V R MAX I MAX (BR)DSS DS(ON) D 100% UIL Tested 150 V 31 m 10 V 31 A These Devices are PbFree, Halogen Free/BFR Free and are RoHS Compliant D Typical Applications Synchronous Rectification ACDC and DCDC Power Supplies ACDC Adapters (USB PD) SR G Load Switch S MAXIMUM RATINGS (T = 25C unless otherwise noted) J NCHANNEL MOSFET Parameter Symbol Value Unit DraintoSource Voltage V 150 V DSS GatetoSource Voltage V 20 V GS Continuous Drain I 31 A D Current R (Note 2) JC Pin 1 Steady T = 25C C State Power Dissipation P 62.5 W D Top Bottom Power 56 R (Note 2) JC (PQFN8) Continuous Drain I 6.1 A D CASE 483AE Current R JA (Notes 1, 2) Steady T = 25C A State MARKING DIAGRAM Power Dissipation P 2.5 W D R (Notes 1, 2) JA S D Pulsed Drain Current T = 25C, t = 100 s I 131 A C p DM S D 3415MC Operating Junction and Storage Temperature T , T 55 to C J stg AYWZZ S D Range +150 G D Single Pulse DraintoSource Avalanche E 54 mJ AS Energy (I = 6 A , L = 3 mH) L pk 3415MC = Specific Device Code Lead Temperature for Soldering Purposes T 260 C L A = Assembly Location (1/8 from case for 10 s) Y = Year W = Work Week Stresses exceeding those listed in the Maximum Ratings table may damage the ZZ = Lot Traceability device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 2 1. Surfacemounted on FR4 board using a 1 in , 2 oz. Cu pad. ORDERING INFORMATION 2. The entire application environment impacts the thermal resistance values shown, they are not constants and are only valid for the particular conditions noted. Device Package Shipping NTMFS034N15MC Power 56 3000 / Tape (PbFree/Halogen Free) (PQFN8) & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Semiconductor Components Industries, LLC, 2020 1 Publication Order Number: May, 2020 Rev. 0 NTMFS034N15MC/D