MOSFET Power, Single, N-Channel 60 V, 1.6 m , 230 A NTMFS5C612N Features www.onsemi.com Small Footprint (5x6 mm) for Compact Design Low R to Minimize Conduction Losses DS(on) Low Q and Capacitance to Minimize Driver Losses G These Devices are PbFree and are RoHS Compliant V R MAX I MAX (BR)DSS DS(ON) D 60 V 1.6 m 10 V 230 A MAXIMUM RATINGS (T = 25C unless otherwise noted) J Parameter Symbol Value Unit DraintoSource Voltage V 60 V DSS D (5) GatetoSource Voltage V 20 V GS Continuous Drain T = 25C I 230 A C D Current R JC T = 100C 160 (Notes 1, 3) C Steady G (4) State Power Dissipation T = 25C P 170 W C D R (Note 1) JC T = 100C 84 C S (1,2,3) Continuous Drain T = 25C I 35 A A D NCHANNEL MOSFET Current R JA T = 100C 25 (Notes 1, 2, 3) A Steady State Power Dissipation T = 25C P 3.8 W A D MARKING R (Notes 1, 2) JA T = 100C 1.9 A DIAGRAM Pulsed Drain Current T = 25C, t = 10 s I 900 A D A p DM 1 S D Operating Junction and Storage Temperature T , T 55 to C J stg DFN5 5C612N S +175 (SO8FL) AYWZZ S Source Current (Body Diode) I 190 A S CASE 488AA G D STYLE 1 D Single Pulse DraintoSource Avalanche E 451 mJ AS Energy (I = 17 A) L(pk) 5C612N = Specific Device Code Lead Temperature for Soldering Purposes T 260 C A = Assembly Location L (1/8 from case for 10 s) Y = Year W = Work Week Stresses exceeding those listed in the Maximum Ratings table may damage the ZZ = Lot Traceability device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. THERMAL RESISTANCE MAXIMUM RATINGS ORDERING INFORMATION Parameter Symbol Value Unit See detailed ordering, marking and shipping information on page 5 of this data sheet. JunctiontoCase Steady State R 0.9 C/W JC JunctiontoAmbient Steady State (Note 2) R 39 JA 1. The entire application environment impacts the thermal resistance values shown, they are not constants and are only valid for the particular conditions noted. 2 2. Surfacemounted on FR4 board using a 650 mm , 2 oz. Cu pad. 3. Maximum current for pulses as long as 1 second is higher but is dependent on pulse duration and duty cycle. Semiconductor Components Industries, LLC, 2016 1 Publication Order Number: June, 2021 Rev. 3 NTMFS5C612N/DNTMFS5C612N ELECTRICAL CHARACTERISTICS (T = 25C unless otherwise specified) J Parameter Symbol Test Condition Min Typ Max Unit OFF CHARACTERISTICS DraintoSource Breakdown Voltage V V = 0 V, I = 250 A 60 V (BR)DSS GS D DraintoSource Breakdown Voltage V / 12.8 (BR)DSS mV/C Temperature Coefficient T J Zero Gate Voltage Drain Current I V = 0 V, T = 25C 10 DSS GS J V = 60 V A DS T = 125C 250 J GatetoSource Leakage Current I V = 0 V, V = 20 V 100 nA GSS DS GS ON CHARACTERISTICS (Note 4) Gate Threshold Voltage V V = V , I = 250 A 2.0 4.0 V GS(TH) GS DS D Threshold Temperature Coefficient V /T 9.4 mV/C GS(TH) J DraintoSource On Resistance R V = 10 V I = 50 A 1.4 1.6 m DS(on) GS D CHARGES, CAPACITANCES & GATE RESISTANCE Input Capacitance C 4830 ISS Output Capacitance C V = 0 V, f = 1 MHz, V = 25 V 3180 pF OSS GS DS Reverse Transfer Capacitance C 22 RSS Total Gate Charge Q 60.2 G(TOT) Threshold Gate Charge Q 14.2 G(TH) nC GatetoSource Charge Q 23.3 V = 10 V, V = 48 V I = 50 A GS GS DS D GatetoDrain Charge Q 6.3 GD Plateau Voltage V 4.9 V GP SWITCHING CHARACTERISTICS (Note 5) TurnOn Delay Time t 14.2 d(ON) Rise Time t 46.9 r V = 10 V, V = 48 V, GS DS ns I = 50 A, R = 2.5 D G TurnOff Delay Time t 38.9 d(OFF) Fall Time t 11.9 f DRAINSOURCE DIODE CHARACTERISTICS Forward Diode Voltage V T = 25C 0.81 1.0 SD J V = 0 V, GS V I = 50 A S T = 125C 0.67 J Reverse Recovery Time t 82.4 RR Charge Time t 40.8 ns a V = 0 V, dI /dt = 100 A/ s, GS S I = 50 A S Discharge Time t 41.6 b Reverse Recovery Charge Q 139 nC RR Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 4. Pulse Test: pulse width 300 s, duty cycle 2%. 5. Switching characteristics are independent of operating junction temperatures. www.onsemi.com 2