MOSFET - Power, Single N-Channel 80 V, 13.1 m , 42 A NVMFS6H852NL Features Small Footprint (5x6 mm) for Compact Design www.onsemi.com Low R to Minimize Conduction Losses DS(on) Low Q and Capacitance to Minimize Driver Losses G V R MAX I MAX (BR)DSS DS(ON) D NVMFS6H852NLWF Wettable Flank Option for Enhanced Optical Inspection 13.1 m 10 V 80 V 42 A AECQ101 Qualified and PPAP Capable 17 m 4.5 V These Devices are PbFree and are RoHS Compliant MAXIMUM RATINGS (T = 25C unless otherwise noted) J D (5,6) Parameter Symbol Value Unit DraintoSource Voltage V 80 V DSS GatetoSource Voltage V 20 V GS Continuous Drain T = 25C I 42 A G (4) C D Current R JC T = 100C 29 (Notes 1, 3) C Steady S (1,2,3) State Power Dissipation P W T = 25C 54 C D R (Note 1) JC NCHANNEL MOSFET T = 100C 27 C Continuous Drain T = 25C I 11 A A D Current R JA MARKING T = 100C 8 (Notes 1, 2, 3) A Steady DIAGRAM State Power Dissipation T = 25C P 3.6 W A D D R (Notes 1, 2) JA 1 T = 100C 1.8 A S D DFN5 S XXXXXX Pulsed Drain Current T = 25C, t = 10 s I 208 A DM A p (SO8FL) AYWZZ S Operating Junction and Storage Temperature T , T 55 to C CASE 488AA J stg G D Range +175 STYLE 1 D Source Current (Body Diode) I 45 A S XXXXXX = 6H852L XXXXXX = (NVMFS6H852NL) or Single Pulse DraintoSource Avalanche E 207 mJ AS XXXXXX = 852LWF Energy (I = 2.2 A) L(pk) XXXXXX = (NVMFS6H852NLWF) Lead Temperature for Soldering Purposes T 260 C L A = Assembly Location (1/8 from case for 10 s) Y = Year W = Work Week Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be ZZ = Lot Traceability assumed, damage may occur and reliability may be affected. THERMAL RESISTANCE MAXIMUM RATINGS ORDERING INFORMATION Parameter Symbol Value Unit See detailed ordering, marking and shipping information in the JunctiontoCase Steady State R 2.8 C/W package dimensions section on page 5 of this data sheet. JC JunctiontoAmbient Steady State (Note 2) 42 R JA 1. The entire application environment impacts the thermal resistance values shown, they are not constants and are only valid for the particular conditions noted. 2 2. Surfacemounted on FR4 board using a 650 mm , 2 oz. Cu pad. 3. Maximum current for pulses as long as 1 second is higher but is dependent on pulse duration and duty cycle. Semiconductor Components Industries, LLC, 2019 1 Publication Order Number: December, 2019 Rev. 0 NVMFS6H852NL/DNVMFS6H852NL ELECTRICAL CHARACTERISTICS (T = 25C unless otherwise specified) J Parameter Symbol Test Condition Min Typ Max Unit OFF CHARACTERISTICS DraintoSource Breakdown Voltage V V = 0 V, I = 250 A 80 V (BR)DSS GS D DraintoSource Breakdown Voltage V / 47.7 (BR)DSS mV/C Temperature Coefficient T J Zero Gate Voltage Drain Current I V = 0 V, T = 25 C 10 DSS GS J A V = 80 V DS T = 125C 100 J GatetoSource Leakage Current I V = 0 V, V = 20 V 100 nA GSS DS GS ON CHARACTERISTICS (Note 4) Gate Threshold Voltage V V = V , I = 45 A 1.2 2.0 V GS(TH) GS DS D Threshold Temperature Coefficient V /T 5.1 mV/C GS(TH) J DraintoSource On Resistance R V = 10 V I = 10 A 10.8 13.1 DS(on) GS D m V = 4.5 V I = 10 A 13.4 17.0 GS D Forward Transconductance g V =8 V, I = 20 A 55 S FS DS D CHARGES, CAPACITANCES & GATE RESISTANCE Input Capacitance C 906 ISS Output Capacitance C 116 V = 0 V, f = 1 MHz, V = 40 V pF OSS GS DS Reverse Transfer Capacitance C 6 RSS Total Gate Charge Q V = 10 V, V = 40 V I = 20 A 17 G(TOT) GS DS D Threshold Gate Charge Q 2 G(TH) nC GatetoSource Charge Q 3.1 GS GatetoDrain Charge Q 2.9 V = 4.5 V, V = 40 V I = 20 A GD GS DS D Plateau Voltage V 3.1 V GP Total Gate Charge Q 8 nC G(TOT) SWITCHING CHARACTERISTICS (Note 5) TurnOn Delay Time t 29 d(ON) Rise Time t 53 r V = 4.5 V, V = 64 V, GS DS ns I = 20 A, R = 2.5 D G TurnOff Delay Time t 18 d(OFF) Fall Time t 6 f DRAINSOURCE DIODE CHARACTERISTICS Forward Diode Voltage V T = 25C 0.81 1.2 SD J V = 0 V, GS V I = 10 A S T = 125C 0.68 J Reverse Recovery Time t 32 RR Charge Time t 20 a ns V = 0 V, dIS/dt = 100 A/ s, GS I = 20 A Discharge Time t S 12 b Reverse Recovery Charge Q 25 nC RR Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 4. Pulse Test: pulse width 300 s, duty cycle 2%. 5. Switching characteristics are independent of operating junction temperatures. www.onsemi.com 2