1SMA10CAT3G Series, SZ1SMA10CAT3G Series 400 Watt Peak Power Zener Transient Voltage Suppressors www.onsemi.com Bidirectional PLASTIC SURFACE MOUNT The SMA series is designed to protect voltage sensitive ZENER OVERVOLTAGE components from high voltage, high energy transients. They have TRANSIENT SUPPRESSORS excellent clamping capability, high surge capability, low zener 1078 V V R impedance and fast response time. The SMA series is supplied in 400 W PEAK POWER ON Semiconductors exclusive, cost-effective, highly reliable SURMETIC package and is ideally suited for use in communication systems, automotive, numerical controls, process controls, medical equipment, business machines, power supplies and many other industrial/consumer applications. SMA Features CASE 403D PLASTIC Working Peak Reverse Voltage Range 10 V to 78 V Standard Zener Breakdown Voltage Range 11.7 V to 91.3 V Peak Power 400 Watts 1 ms ESD Rating of Class 3 (> 16 kV) per Human Body Model MARKING DIAGRAM Response Time is Typically < 1 ns Flat Handling Surface for Accurate Placement Package Design for Top Slide or Bottom Circuit Board Mounting xxC AYWW Low Profile Package SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements AECQ101 Qualified and PPAP Capable xxC = Device Code (Refer to page 3) These are PbFree Devices* A = Assembly Location Y = Year WW = Work Week Mechanical Characteristics: = PbFree Package CASE: Void-free, transfer-molded plastic FINISH: All external surfaces are corrosion resistant and leads are ORDERING INFORMATION readily solderable MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: ** Package Device Shipping 260C for 10 Seconds 1SMAxxCAT3G SMA 5,000 / POLARITY: Cathode polarity notch does not indicate polarity (PbFree) Tape & Reel MOUNTING POSITION: Any SZ1SMAxxCAT3G SMA 5,000 / (PbFree) Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. **The T3 suffix refers to a 13 inch reel. DEVICE MARKING INFORMATION See specific marking information in the device marking *For additional information on our PbFree strategy and soldering details, please column of the Electrical Characteristics table on page 3 of download the ON Semiconductor Soldering and Mounting Techniques this data sheet. Reference Manual, SOLDERRM/D. Semiconductor Components Industries, LLC, 2016 1 Publication Order Number: April, 2016 Rev. 13 1SMA10CAT3/D1SMA10CAT3G Series, SZ1SMA10CAT3G Series MAXIMUM RATINGS Rating Symbol Value Unit Peak Power Dissipation (Note 1) T = 25C, Pulse Width = 1 ms P 400 W L PK DC Power Dissipation T = 75C Measured Zero Lead Length (Note 2) P 1.5 W L D Derate Above 75C 20 mW/C Thermal Resistance from JunctiontoLead R 50 C/W JL DC Power Dissipation (Note 3) T = 25C P 0.5 W A D Derate Above 25C 4.0 mW/C Thermal Resistance from JunctiontoAmbient 250 C/W R JA Operating and Storage Temperature Range T , T 65 to +150 C J stg Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. 10 X 1000 s, nonrepetitive. 2. 1 in square copper pad, FR4 board. 3. FR4 board, using ON Semiconductor minimum recommended footprint, as shown in 403B case outline dimensions spec. ELECTRICAL CHARACTERISTICS (T = 25C unless otherwise noted) I A I PP Symbol Parameter I Maximum Reverse Peak Pulse Current PP I T V Clamping Voltage I C PP V V V I R C BR RWM V V Working Peak Reverse Voltage I V V V RWM R RWM BR C I T I Maximum Reverse Leakage Current V R RWM V Breakdown Voltage I BR T I Test Current I PP T BiDirectional TVS www.onsemi.com 2