MMSZ52xxxT1G Series, SZMMSZ52xxxT1G Series Zener Voltage Regulators 500 mW SOD123 Surface Mount Three complete series of Zener diodes are offered in the convenient, www.onsemi.com surface mount plastic SOD123 package. These devices provide a convenient alternative to the leadless 34package style. Zener voltage in this series are specified with device junction in thermal equilibrium. Features 500 mW Rating on FR4 or FR5 Board SOD123 Wide Zener Reverse Voltage Range 2.4 V to 110 V Thermal CASE 425 STYLE 1 Equilibrium* Package Designed for Optimal Automated Board Assembly Small Package Size for High Density Applications 1 2 General Purpose, Medium Current Cathode Anode ESD Rating of Class 3 (> 16 kV) per Human Body Model SZ Prefix for Automotive and Other Applications Requiring Unique MARKING DIAGRAM Site and Control Change Requirements AECQ101 Qualified and PPAP Capable xx M 1 These are PbFree Devices* Mechanical Characteristics: CASE: Void-free, transfer-molded, thermosetting plastic case xx = Device Code (Refer to page 3) FINISH: Corrosion resistant finish, easily solderable M = Date Code MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: = PbFree Package 260C for 10 Seconds (Note: Microdot may be in either location) POLARITY: Cathode indicated by polarity band FLAMMABILITY RATING: UL 94 V0 ORDERING INFORMATION Device Package Shipping MAXIMUM RATINGS MMSZ52xxBT1G, SOD123 3,000 / Rating Symbol Max Units SZMMSZ52xxBT1G (PbFree) Tape & Reel Total Power Dissipation on FR5 Board, P D MMSZ52xxCT1G, SOD123 3,000 / (Note 1) T = 75C 500 mW L SZMMSZ52xxCT1G Derated above 75C 6.7 mW/C (PbFree) Tape & Reel MMSZ52xxBT3G, SOD123 10,000 / Thermal Resistance, JunctiontoAmbient R 340 C/W JA SZMMSZ52xxBT3G (Note 2) (PbFree) Tape & Reel MMSZ52xxCT3G, SOD123 10,000 / Thermal Resistance, JunctiontoLead R 150 C/W JL SZMMSZ52xxCT3G (Note 2) (PbFree) Tape & Reel For information on tape and reel specifications, Junction and Storage Temperature Range T , T 55 to +150 C J stg including part orientation and tape sizes, please Stresses exceeding those listed in the Maximum Ratings table may damage the refer to our Tape and Reel Packaging Specifications device. If any of these limits are exceeded, device functionality should not be Brochure, BRD8011/D. assumed, damage may occur and reliability may be affected. 1. FR5 = 3.5 X 1.5 inches, using the minimum recommended footprint. 2. Thermal Resistance measurement obtained via infrared Scan Method. DEVICE MARKING INFORMATION See specific marking information in the device marking *For additional info on thermal equilibrium, please download, ON Semiconductor column of the Electrical Characteristics table on page 3 of TVS/Zener Theory and Design Considerations Handbook, HBD854/D. this data sheet. *For additional information on our PbFree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Semiconductor Components Industries, LLC, 2015 1 Publication Order Number: March, 2015 Rev. 14 MMSZ5221BT1/DMMSZ52xxxT1G Series, SZMMSZ52xxxT1G Series ELECTRICAL CHARACTERISTICS (T = 25C unless A I otherwise noted, V = 0.95 V Max. I = 10 mA) F F I F Symbol Parameter V Reverse Zener Voltage I Z ZT I Reverse Current ZT V V Z Maximum Zener Impedance I Z R ZT ZT V I V R F I Reverse Current I ZK ZT Z Maximum Zener Impedance I ZK ZK I Reverse Leakage Current V R R V Reverse Voltage R I Forward Current F V Forward Voltage I Zener Voltage Regulator F F www.onsemi.com 2