SD05T1 Series, SZSD05T1 Series ESD Protrection Diode SOD323 Diodes for ESD Protection These surge protection diodes are designed for applications requiring www.onsemi.com transient overvoltage protection capability. They are intended for use in voltage and ESD sensitive equipment such as computers, printers, business machines, communication systems, medical equipment and other applications. These devices are ideal for situations where board space is at a premium. MARKING DIAGRAM Specification Features: Steady State Power Routing of 300 mW xx M Peak Power 350 W (8 20 s) SOD323 Low Leakage CASE 477 Cathode Indicated by Polarity Band STYLE 1 Package Weight: 4.507 mg/wmt xx = Specific Device Code Meets IEC6100042 Level 4, 15 kV (Air), 8 kV (Contact) ZA = SD05T1 Meets IEC610044 Level 4, 40 A ZC = SD12T1 M = Month Code Meets IEC610045 (Lightning), 24 A = PbFree Package Meets 16 kV Human Body Model ESD Requirements (Note: Microdot may be in either location) SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements AECQ101 Qualified and ORDERING INFORMATION PPAP Capable These Devices are PbFree and are RoHS Compliant Device Package Shipping SD05T1G Mechanical Characteristics: CASE: Void-free, transfer-molded, thermosetting plastic SZSD05T1G SOD323 3000/Tape & Reel Epoxy Meets UL 94, V0 (PbFree) SD12T1G LEAD FINISH: 100% Matte Sn (Tin) SZSD12T1G MOUNTING POSITION: Any QUALIFIED MAX REFLOW TEMPERATURE: 260C For information on tape and reel specifications, including part orientation and tape sizes, please Device Meets MSL 1 Requirements refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Use the Device Number to order the 7 inch/3,000 unit reel. Replace the T1 with T3 in the Device Number to order the 13 inch/10,000 unit reel. Semiconductor Components Industries, LLC, 2014 1 Publication Order Number: November, 2017 Rev. 5 SD05T1/DSD05T1 Series, SZSD05T1 Series MAXIMUM RATINGS Rating Symbol Value Unit Peak Power Dissipation 20 s (Note 1) P 350 Watts pk T 25C L IEC 6100042 (ESD) Air 15 kV Contact 8.0 IEC 6100044 (EFT) 40 A ESD Voltage (Human Body Model (HBM) Waveform per IEC 6100042) V 30 kV PP Total Power Dissipation on FR4 Board (Note 2) T = 25C P 300 mW A D Derate above 25C 2.4 mW/C Thermal Resistance, JunctiontoAmbient R 416 C/W JA Junction and Storage Temperature Range T , T 55 to +150 C J stg Lead Solder Temperature Maximum (10 Second Duration) T 260 C L Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. *Other voltages may be available upon request. 1. Nonrepetitive current pulse, per Figure 6. 2 2. FR4 printed circuit board, singlesided copper, mounting pad 1 cm . ELECTRICAL CHARACTERISTICS I (T = 25C unless otherwise noted) A I F Symbol Parameter I Maximum Reverse Peak Pulse Current PP V Clamping Voltage I C PP V V V V Working Peak Reverse Voltage C BR RWM RWM V I V R F I Maximum Reverse Leakage Current V I R RWM T V Breakdown Voltage I BR T I Test Current T I Forward Current F I PP V Forward Voltage I F F UniDirectional ELECTRICAL CHARACTERISTICS Max V , Breakdown Voltage Capacitance BR (V) (pF) V I = 5 A Max I V Max I C PP PP C PP V I V I V = 0 V (Note 3) (Note 3) (Note 3) R RWM R RWM T f = 1.0 MHz (V) ( A) Min Max mA Device (V) (A) (V) SD05T1G 5.0 10 6.2 7.3 1.0 9.8 24 14.5 350 SD12T1G 12 1.0 13.3 15.75 1.0 19 15 25 150 Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 3. 8 20 s pulse waveform. *Include SZprefix devices where applicable. www.onsemi.com 2