3.2 x 1.6 x 0.9mm Red & Pure green SMD 3.2 x 1.6 x 0.9mm Red & Pure green SMD OSRP1206C1F VVEERR..AA..22..11 Features Outline Dimension Bi-Color Super high brightness of surface mount LED 1 2 2 1 3 4 4 3 Water Clear Flat Mold Compact package outline 2222 1111 33 44 33 44 (LxWxT) of 3.2mm x 1.6mm x 0.9mm Compatible to IR reflow soldering. Notes: Applications 1. All dimensions are in millimeters Backlighting (switches, keys, etc.) 2. Tolerance is 0.10 mm unless otherwise noted. Marker lights (e.g. steps, exit ways, etc.) R ecomm ended Sol deri ng P atter n ( Uni ts : m m) Absolute Maximum Rating ((TTaa==2255)) ((TTaa==2255)) Directivity Value 0 Item Symbol Unit Red PG DC Forward Current I mA F 30 30 Pulse Forward Current* I mA FP 100 100 Reverse Voltage V V 5 5 R 0 Power Dissipation mW P 78 108 D Operating Temperature Topr -40 ~ +85 Storage Temperature Tstg -40~ +85 Lead Soldering Temperature Tsol 260/10sec - *Pulse width Max 0.1ms, Duty ratio max 1/10 Electrical -Optical Characteristics ((((TTTTaaaa====22225555)))) 21/2(deg) V (V) I (A) Iv(mcd) D(nm) F R Min. Typ. Max. Max. Min. Typ. Max. Min. Typ. Max. Typ. Part Number Color I =20mA V =5V I =20mA F R F Red HR 1.8 2.1 2.6 10 - 100 - 620 625 630 120 OSRG1206C1F Pure green PG 2.6 3.1 3.6 10 - 350 - 515 525 530 120 *1 Tolerance of measurements of dominant wavelength is +1nm *2 Tolerance of measurements of luminous intensity is +15% *3 Tolerance of measurements of forward voltage is +0.1V LED & Application Technologies 3.2 x 1.6 x 0.9mm Red & Pure green SMD OSRP1206C1F VER.A.2.1 Soldering Conditions Reflow Soldering Hand Soldering Pre-Heat 180 ~ 200C Pre-Heat Time 120 sec. Max. 350C Max. Peak temperature 260C Max. Temperature 3 sec. Max. Dipping Time 10 sec. Max. Soldering time (one time only) Condition Refer to Temperature-profile Reflow Soldering Condition(Lead-free Solder) 1~5C / sec. 260C Max. 10sec.Max. Pre-heating 180~200 C 60 sec.Max. 1~5C / sec. Above 220C 120sec.Max. *Recommended soldering conditions vary according to the type of LED *Although the recommended soldering conditions are specified in the above table, reflow, or hand soldering at the lowest possible temperature is desirable for the LEDs. *A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature. All SMD LED products are pb-free soldering available. Occasionally there is a brightness decrease caused by the influence of heat or ambient atmosphere during air reflow. It is recommended that the User use the nitrogen reflow method. Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable a double-head soldering iron should be used. It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing. Reflow soldering should not be done more than two times. When soldering, do not put stress on the LEDs during heating. After soldering, do not warp the circuit board. LED & Application Technologies