OSTB1206C1E-A Optosupply

33..00 xx 11..55 xx 00..77mmmm RReedd && PPuurree ggrreeeenn && BBlluuee SSMMDD OSTB1206C1E-A Features Outline Dimension Full-Color 1 2 2 1 Super high brightness of surface mount LED 3 4 4 3 Water Clear Flat Mold 22 22 1111 Compact package outline 4444 3333 (LxWxT) of 3.0mm x 1.5mm x 0.7mm Compatible to IR reflow soldering. Notes: Applications 1. All dimensions are in millimeters Backlighting (switches, keys, etc.) 2. Tolerance is 0.10 mm unless otherwise noted. Marker lights (e.g. steps, exit ways, etc.) R ec ommen d ed S ol de rin g Pa tt er n (U n it s : mm) Absolute Maximum Rating ((((TTTTaaaa====22225555)))) Directivity Symbo Value 0 Item Unit G/B l Red DC Forward Current IF mA 30 30 Pulse Forward Current* IFP mA 100 100 Reverse Voltage V VR 5 5 0 Power Dissipation mW PD 78 108 Operating Temperature Topr -40 ~ +85 Storage Temperature Tstg -40~ +85 Lead Soldering Temperature - Tsol 260/5sec *Pulse width Max 0.1ms, Duty ratio max 1/10 Electrical -Optical Characteristics ((((TTTTaaaa====22225555)))) 21/2(deg) V (V) I (A) Iv(mcd) D(nm) F R Min. Typ. Max. Max. Min. Typ. Max. Min. Typ. Max. Typ. Part Number Color I =20mA V =5V I =20mA F R F Blue BL 2.8 2.9 3.6 10 100 200 - 460 466 472 120 OSTB1206C1E-A Pure Green PG 2.8 2.9 3.6 10 400 600 - 515 520 525 120 Red HR 10 100 200 - 615 620 625 120 1.8 2.0 2.6 *1 Tolerance of measurements of dominant wavelength is +1nm *2 Tolerance of measurements of luminous intensity is +15% *3 Tolerance of measurements of forward voltage is0.1V LED & Application Technologies 33..00 xx 11..55 xx 00..77mmmm RReedd && PPuurree ggrreeeenn && BBlluuee SSMMDD OSTB1206C1E-A Recommended Soldering Temperature Time Profile (Reflow Soldering) Surface Mounting Condition In automatic mounting of the SMD LEDs on printed circuit boards, any bending, expanding and pulling forces or shock against the SMD LEDs should be kept min. to prevent them from electrical failures and mechanical damages of the devices. Soldering Reflow -Soldering of the SMD LEDs should conform to the soldering condition in the individual specifications. -SMD LEDs are designed for Reflow Soldering. -In the reflow soldering, too high temperature and too large temperature gradient such as rapid heating/cooling may cause electrical & optical failures and damages of the devices. -We cannot guarantee the LEDs after they have been assembled using the solder dipping method. LED & Application Technologies