1.8mm 2.0mm/2.2mm Width 1.8mm For board-to-FPC Narrow pitch connectors A4US Series (0.4mm pitch) FEATURES 1. Slim body width of 2.0 mm/2.2 mm 3. ensures contributes to space-saving. high resistance to various 2. A wide lineup contributes to the environments in lieu of its space- design freedom. saving footprint. Soldering terminals Ni barrier Bellows contact at each corner construction construction (Against solder rise ) (Against dropping ) Suction face Socket Header Porosity treatment (Against corrosive gases ) RoHS compliant Socket Soldering terminals V notch and Double contact constructions at each corner (Against foreign particles and flux ) Suction face 4. Simple lock structure provides tactile feedback to ensure excellent mating/unmating operation feel. 5. Soldering terminals at each corner enhance mounting strength. Header 6. Gull-wing-shaped terminals to facilitate visual inspections. Unit: mm Mated height Width for socket 0.8 1.0 1.5 APPLICATIONS 2.2 Suitable for board-to-FPC connections 2.0 in mobile equipment that requires size Socket 0.6 0.64 Suction and thickness reduction and face Header 0.7 0.76 functionality enhancement. ORDERING INFORMATION 0.8 mm 1.0 mm, 1.5 mm AXE 2 D AXE 2 4 D 1: Socket 1: Socket 2: Header 2: Header Number of pins (2 digits) Number of pins (2 digits) Mated height/Width Mated height/Width <Socket> <Socket> 5: 0.8 mm mated height/2.0 mm width 2: 1.0 mm, 1.5 mm mated height/2.2 mm width <Header> <Header> 1: 0.8 mm mated height/2.0 mm width 2: 1.0 mm mated height/2.2 mm width 3: 1.5 mm mated height/2.2 mm width Functions 2: Without positioning bosses Functions 2: Without positioning bosses Surface treatment (Contact portion / Terminal portion) <Socket> Surface treatment (Contact portion / Terminal portion) 7: Base: Ni plating, Surface: Au plating (for Ni barrier available) <Socket> <Header> 4: Base: Ni plating, Surface: Au plating (for Ni barrier available) 4: Base: Ni plating, Surface: Au plating <Header> 4: Base: Ni plating, Surface: Au plating Package D: Embossed packaging (4 mm pitch) Package D: Embossed packaging (4 mm pitch) ACCTB4E 201409-T 1 New 12.5 mm (50 pin contacts) 11.8 mm (50 pin contacts)Narrow pitch connectors A4US (0.4mm pitch) PRODUCT TYPES Part number Packing Mated height Number of pins Socket Header Inner carton (1-reel) Outer carton 10 AXE110527D AXE210124D 14 AXE114527D AXE214124D 18 AXE118527D AXE218124D 20 AXE120527D AXE220124D 24 AXE124527D AXE224124D 30 AXE130527D AXE230124D 0.8mm 34 AXE134527D AXE234124D 36 AXE136527D AXE236124D 40 AXE140527D AXE240124D 50 AXE150527D AXE250124D 60 AXE160527D AXE260124D 10,000 pieces 20,000 pieces 70 AXE170527D AXE270124D 80 AXE180527D AXE280124D 10 AXE110224D AXE210224D 20 AXE120224D AXE220224D 34 AXE134224D AXE234224D 1.0mm 40 AXE140224D AXE240224D 60 AXE160224D AXE260224D 80 AXE180224D AXE280224D 20 AXE120224D AXE220324D 1.5mm 60 AXE160224D AXE260324D 80 AXE180224D AXE280324D Notes: 1. Order unit: For volume production: 1-inner carton (1-reel) units Samples for mounting check: 50-connector units. Please contact our sales ofce. Samples: Small lot orders are possible. Please contact our sales ofce. 2. Please contact us for connectors having a number of pins other than those listed above. SPECIFICATIONS 1. Characteristics Item Specications Conditions Rated current 0.30A/pin contact (Max. 5 A at total pin contacts) Rated voltage 60V AC/DC No short-circuiting or damage at a detection current of 1 mA Electrical Breakdown voltage 150V AC for 1 min. when the specied voltage is applied for one minute. characteristics Insulation resistance Min. 1,000M (initial) Using 250V DC megger (applied for 1 min.) Based on the contact resistance measurement method Contact resistance Max. 90m specied by JIS C 5402. Composite insertion force Max. 0.981N/pin contacts pin contacts (initial) Mechanical Composite removal force Min. 0.165N/pin contacts pin contacts characteristics Contact holding force Measuring the maximum force. Min. 0.20N/pin contacts (Socket contact) As the contact is axially pull out. Ambient temperature 55C to +85C No freezing at low temperatures. No dew condensation. Peak temperature: 260C or less (on the surface of Infrared reow soldering the PC board around the connector terminals) Soldering heat resistance 300C within 5 sec. 350C within 3 sec. Soldering iron 55C to +85C (product only) Storage temperature No freezing at low temperatures. No dew condensation. 40C to +50C (emboss packing) Conformed to MIL-STD-202F, method 107G Order Temperature (C) Time (minutes) 0 1 55 30 5 cycles, 3 Environmental Thermal shock resistance insulation resistance min. 100M, 2 Max. 5 characteristics (header and socket mated) +3 contact resistance max. 90m 3 85 30 0 4 Max. 5 0 55 3 Humidity resistance 120 hours, insulation resistance min. 100M, Bath temperature 402C, (header and socket mated) contact resistance max. 90m humidity 90 to 95% R.H. Saltwater spray resistance 24 hours, insulation resistance min. 100M, Bath temperature 352C, (header and socket mated) contact resistance max. 90m saltwater concentration 51% H2S resistance Bath temperature 402C, gas concentration 31 ppm, 48 hours, contact resistance max. 90m (header and socket mated) humidity 75 to 80% R.H. Lifetime Repeated insertion and removal speed of max. 200 times/ Insertion and removal life 30 times characteristics hours 60 pin contacts Socket (h = 0.8mm: 0.03g, h = 1.0/1.5mm: 0.04g) Unit weight Header (h = 0.8mm: 0.02g, h = 1.0mm: 0.02g, h = 1.5mm: 0.03g) ACCTB4E 201409-T 2