X-On Electronics has gained recognition as a prominent supplier of ENW89819AYKF Bluetooth Modules - 802.15.1 across the USA, India, Europe, Australia, and various other global locations. ENW89819AYKF Bluetooth Modules - 802.15.1 are a product manufactured by Panasonic. We provide cost-effective solutions for Bluetooth Modules - 802.15.1, ensuring timely deliveries around the world.

ENW89819AYKF Panasonic

ENW89819AYKF electronic component of Panasonic
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Part No.ENW89819AYKF
Manufacturer: Panasonic
Category: Bluetooth Modules - 802.15.1
Description: Bluetooth Modules - 802.15.1 Eval Kit for PAN1326C2
Datasheet: ENW89819AYKF Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
N/A

Obsolete
Availability Price Quantity
0
MOQ : 5
Multiples : 1
5 : USD 132.211
10 : USD 131.2187
25 : USD 130.2265
50 : USD 129.2215
100 : USD 128.2165
250 : USD 127.2115
500 : USD 126.1938
1000 : USD 125.1762
5000 : USD 124.1457
N/A

Obsolete
0
MOQ : 1
Multiples : 1
1 : USD 279.1596
10 : USD 253.4124
100 : USD 248.5421
N/A

Obsolete
0
MOQ : 1
Multiples : 1
1 : USD 239.2687
N/A

Obsolete
   
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Product Category
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Silicon Manufacturer
Silicon Core Number
Kit Application Type
Application Sub Type
Kit Contents
Product Range
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We are delighted to provide the ENW89819AYKF from our Bluetooth Modules - 802.15.1 category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the ENW89819AYKF and other electronic components in the Bluetooth Modules - 802.15.1 category and beyond.

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PAN1326C2 Bluetooth Basic Data Rate and Low Energy Module Product Specification Rev. 1.2 Wireless Modules PAN1326C2 Bluetooth Module Overview Features Panasonics new PAN1326C2 is a Host Controlled Bluetooth 4.2 compliant up to the HCI layer Interface (HCI) Bluetooth Radio Frequency (RF) Best-in-class Bluetooth RF performance module that brings Texas Instruments (Tx, Rx sensitivity, blocking) Incorporated seventh generation Bluetooth core Dimensions: 9.0 mm x 9.5 mm x 1.8 mm integrated circuit, the CC2564C, to an easy-to-use Based upon Texas Instruments CC2564C module format. The PAN1326C2 is Interfaces: UART, GPIO, PCM Bluetooth 4.2 compliant and it offers best-in-class RF performance with about twice the range of other Bluetooth Low Energy solutions. Panasonics tiny footprint technology has produced a module of only Characteristics 85.5mm. The module is designed to accommodate Bluetooth 4.2 PCBs pad pitch of 1.3mm and as few as two layers for easy implementation and manufacturing. The Receiver sensitivity: -90dBm module has been designed to be 100 percent Output power: 8dBm pin-compatible with previous generations of Texas Power supply: 1.7V to 4.8V Instruments based Bluetooth HCI modules. Power consumption: Tx 40mA Power consumption: Rx 20mA Operating temperature range: -40C to 85C Block Diagram Product Specification Rev. 1.2 Page 2

Tariff Desc

8542.3 - Electronic integrated circuits:
8542.31.00 -- Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
.Digital:
61 No ..Linear/analogue and peripheral integrated circuits, timers, voltage regulators, A/D and D/A converters, telecommunication and modem integrated circuits, other than board level products
62 No ..Other
63 No Hybrid integrated circuits
64 No Multichip integrated circuits
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