Light Touch Switches/EVPAD 10 mm Square Center Space Long Travel SMD Light Touch Switches Type: EVPAD Features The open center space allows for ex ibility in choosing a LED Up to a 4.2-mm diameter chip LED can be mounted. Provides an excellent operational feel. Crisp tactile feedback Long stroke (1 mm) Supports auto reow s oldering. Recommended Applications Control switches for automotive electronic equipment, such as car audio systems and heater control panels Explanation of Part Numbers 1 2 3456789 E V P AD Product Code Type Height 6th Terminal K 6 Terminals Speci cations Type Snap action/Push-on type SPST Rating 10 A 2 Vdc to 50 mA 12 Vdc (Resistive load) Contact Resistance 100 m max. Electrical Insulation Resistance 100 M min. (at 100 Vdc) Dielectric Withst and ing Voltage 250 Vac for 1 minute Bouncing 10 ms max. (ON, OFF) Operating Force4.0 N0.8 N Mechanical Travel 1.0 mm0.15 mm EnduranceOperating Life 100000 cycles min. Operating Temperature 40 C to +85 C 40 C to +85 C (Bulk) Storage Temperature 20 C to +60 C (Taping) Minimum Quantity/Packing Unit 1000 pcs. Embossed Taping (Reel Pack) Quantity/Carton 5000 pcs. Design and speci cations are each subject to change without notice. Ask factory for the current technical speci cations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 00 Oct. 20127 Light Touch Switches/EVPAD Dimensions in mm (not to scale) EVPADK04K LED implementation position (Embossed Taping) 9.8 0.8 A3 A1 B1 B2 A2 A4 LED implementation area 11.30.1 8.40.1 A1 A3 +0 10.350.4 B1 B2 A1,A2,A3,A4 A2 A4 B1,B2 Circuit Diagram PWB land pattern for reference (Precautions for pattern design) Note that the terminals are exposed at the sections shaded with Establish electrical connection at A1, A2, A3, and A4 to improve the contact performance. Embossed Carrier Tap ing Recommended Re ow Soldering Conditions Tape width=16.0 mm MAX. Chip pocket t Feeding hole 260 1 Fan or Normal Temp. P P 2 0 D 0 230 180 A 150 1 t 2 P Tape running direction 1 Chip component The delivered carrier tape shape is either1 or2. (Normal Temp.) Dimension only applies to shape . t 2 3 90 to 30 40 to 10 t 2 2 t 3 Soldering Time (s) Unit: mm 1 2 0 0 Dia 1 2 3 Part No. Height A B W F E P P P D t t t +0.1 EVPAD 4.6 10.70.2 10.70.2 16.00.3 7.50.1 1.750.10 12.00.1 2.00.1 4.00.1 1.5 0.400.05 4.80.2 5.82.0 0 Standard Reel Dimensions in mm (not to scale) T E Item A B C D E C Rate (mm) 380.02.0 80.01.0 13.00.5 21.01.0 2.00.5 Item W T t r D r Rate (mm) 17.50.5 21.51.0 A W t Design and speci cations are each subject to change without notice. Ask factory for the current technical speci cations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 00 Oct. 2012 4.5 4.2 Operation Top (C) 10.15 4.7 9.8 +0.2 3.2 0.1 0.7 0.8 0.8 0.8 B 3.2 1.20.1 1.20.1 0.5 max. (Plastic projection) B 1.20.1 3.20.1 F E W