EVP-AVAA1A Panasonic

Light Touch Switches/EVPAV 2.8 mm 2.3 mm Side-operational Edge Mount Light Touch Switches Type: EVPAV Features External dimensions : 2.8 mm 2.3 mm (Excluding the push plate), Height 1.95 mm (Printed circuit board being as low as 0.975 mm) Improved soldering strength in the operating direction Recommended Ap pli ca tions Operation switches for portable electronic equipment (Mobile phones, Digital still cameras, Camcorders Portable audio players, etc.) Explanation of Part Numbers 1 2 3 4 5 6 7 8 9 E V P AV Product Code Type Speci cations Type Snap action / Push-on type SPST Rating 10 A 2 Vdc to 20 mA 15 Vdc (Resistive load) Con tact Resistance 500 m max. Ele ctrical Insulation Resistance 50 M min. (at 100 Vdc) Di electric Withst and ing Voltage 250 Vac (1 minute) Bouncing 10 ms max. (ON, OFF) Operating Force 1.6 N Mechanical Push Travel 0.13 mm Push Strength 50 N (15 seconds) EnduranceOperating Life 300000 cycles min. Operating Temperature 40 C to +85 C 40 C to +85 C (Bulk) Storage Temper a ture 20 C to +60 C (Taping) Minimum Quantity/Packing Unit 8000 pcs. Embossed Taping (Reel Pack) Quantity/Carton 40000 pcs. Design and speci cations are each subject to change without notice. Ask factory for the current technical speci cations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 00 Oct. 2012 ES106 Light Touch Switches/EVPAV Dimensions in mm (not to scale) General dimension tolerance : 0.1 EVPAV ( )dimensions are reference dimensions. This reference specifications are subject to change. This product is designed to be smaller than the conventional type, which lowered the film peel off strength. Therefore please avoid to apply force to a push plate from side, or/and avoid set-knob to touch push plate during insertion to a set-case. Circuit Diagram A 2.8 2.30.2 1 These dimensions are from the outer shape to the center of push plate. 2 These dimensions are from the center of datum A. 2.000.15 (0.75) 0.6 0.650.15 Push plate Adhesive 3.200.05 1)1.40.2 0.920.05 1.500.05 Push plate side (1.88) (2.8) Soldering thickness t=0.10.02 PWB land pattern for reference Height from surface of PCB : 0.975 mm Recommended Re ow Soldering Conditions Embossed Carrier Tap ing Tape width=8.0 mm MAX. Feeding hole 260 Fan or Normal Temp. G Chip F pocket 230 D E I 180 150 Tape running direction Taping condition : Lack of products in the middle of taping should be one MAX, but total quantity specified in the (Normal Temp.) specifications should be secured. Peeling off strength of top tape : It should be within 0.2N to 1. ON at 9030 4010 165 degree in peeling off angle. Joint of carrier tape : One joint per one reel may exist. Soldering Time (s) Unit: mm Part No. Height A B C D E F G H I J K L t +0.1 EVPAV 1.95 8.00.3 1.750.10 3.50.1 4.00.1 4.00.1 2.00.1 1.5 0 3.10.2 2.80.2 1.350.20 2.70.2 (6.25) 0.30.1 Standard Reel Dimensions in mm (not to scale) G Item A B C D E E Rate (mm) 380.02.0 80.01.0 13.00.5 21.01.0 2.00.5 C Item F G D Rate (mm) 9.41.0 13.41.0 A F Design and speci cations are each subject to change without notice. Ask factory for the current technical speci cations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 00 Oct. 2012 ES107 Operation Top (C) 1.930.15 1.95 (1.63) 0.3 B 0.65 0.65 (0.98) 2) 1.000.08 2) 1.000.08 0.650.05 0.400.05 A L 1) 0.9750.200 C B 0.9 0.450.05 1.420.05 0.9750.200 t J H K