Light Touch Switches/EVPAW 3.0 mm2.0 mm SMD Light Touch Switches Type: EVPAW Features External dimensions : 3.0 mm 2.0 mm, Height 0.6 mm High operability equipped with an actuator(push plate) IP67 Recommended Applications Operationswitchesfor portable electronicequipments (Mobile phone, Portable audio) Explanation of Part Numbers(Standard specification only) 1 2 345678 9 D4A Product Code Type Operating Height Force Speci cations Type Snap action/Push-on type SPST Rating 10 A 2 V DC to 20 mA 15 V DC (Resistive load) Contact Resistance 500 m max. Electrical Insulation Resistance 50 M min. (at 100 V DC) Dielectric With standi ng Voltage 250 V AC for 1 minute Bouncing 10 ms max. (ON, OFF) Operating Force 1.6 N, 2.4 N, 3.3 N Mechanical Travel 1.6 N, 2.4 N : 0.13 mm 3.3 N : 0.15 mm Endurance Operating Life 1.6 N, 2.4 N : 500,000 cycles min. 3.3 N : 300,000 cycles min. Dust resistance : 4 types of talc 8 h, Protective Structure IP67( 1) Water resistance : Immersion depth 1 m 30 min. Operating Temperature 40 C to +85 C 40 C to +85 C (Bulk) Storage Temperature 20 C to +60 C (Taping) Minimum Quantity/Packing Unit 10,000 pcs. Embossed Taping (Reel Pack) Quantity/Carton 50,000 pcs. Note: Non washable ( 1) IP67 : Switch shall not be operated during test. Water or dust ingress shall be limited enough to prevent deleterious effect to the switch function. However, IP67 shall be guaranteed under single product state, then there is a possibility that IP67 performance become impaired depending on your mounting condition or usage. So, please ask us in advance, if the switch is applied to important usage for water and dust resistant. LQGXVWULDO SDQDVRQLF FRP DF H 1 Light Touch Switches/EVPAW Dimensions in mm (not to scale) EVPAW Embossed Taping) ( General dimension tolerance : 0.05 ( )dimensions are reference dimensions. This reference specications are subject to change. 0.60.1 3.3 ( ) 0.385 There should be cutout on the terminal ( ) 0.85 A A Circuit diagram 3 Without lm The thickness of the solder stencil shall be 0.1 mm, 3.5 and the opening ratio of the solder stencil to a land pattern shall be 60 to 100 % (recommend 80 %.) 3.8 2.7 0.1max. (1.9) No Soldering area A A Land pattern plan Soldering failure may occur depending on applied solder amount, so, please consider to use our recommended stencil and land pattern desing. : Recommended land pattern area : No soldering area Any land pattern or via holes shall not be provided at area. If it s necessary to design land pattern or via holes at area, please apply resist to them to protect their metal part completely. If their metal parts are not protected completely, short circuit failure may occur, Besides, there should be convexoconcave by designing additional pattern, it may cause swith tilt, inuence on solder-ability or ux intrusion after reow soldering. Therefore, please study any inuence of additioan land pattern or via holes at area in advance. Part Numbers Operating Force Height Operating Life EVPAWBD4A 1.6 N 0.6 mm 500,000 cycles EVPAWCD4A 2.4 N 0.6 mm 500,000 cycles EVPAWED4A 3.3 N 0.6 mm 300,000 cycles 2 (2-0.8) 0.1max. 2-1.3 0.040.03 ( ) 2 2 without the lm and remainder of the gate 2-1.5