Light Touch Switches/EVPBL
2.8 mm1.9 mm SMD Light Touch Switches
Type:
EVPBL
Features
External dimensions: 2.8 mm1.9 mm, Height 0.53 mm, 0.57 mm
High operability equipped with an actuator (push plate)
IP67
Recommended Applications
Operation switches for portable electronic equipments
(Mobile phone, Portable audio)
Explanation of Part Numbers(Standard specification only)
1 2 3 4 567 8 9 10 11 12
BL A0B 00
Product Code Type Operating Height
Force
Speci cations
Type Snap action/Push-on type SPST
Rating 10 A 2 V DC to 20 mA 15 V DC (Resistive load)
Contact Resistance 500 m max.
Electrical Insulation Resistance 50 M min. (at 100 V DC)
Dielectric With standing Voltage 250 V AC for 1 minute
Bouncing 10 ms max. (ON, OFF)
Operating Force 1.6 N, 2.25 N
Mechanical
Travel 0.15 mm
Endurance Operating Life 300,000 cycles min.
Dust resistance : 4 types of talc 8 h,
Protective Structure IP67( 1)
Water resistance : Immersion depth 1 m 30 min.
Operating Temperature 40 C to +85 C
40 C to +85 C (Bulk)
Storage Temperature
20 C to +60 C (Taping)
Minimum Quantity/Packing Unit 16,000 pcs. Embossed Taping (Reel Pack)
Quantity/Carton
80,000 pcs.
Note: Non washable
( 1) IP67 : Switch shall not be operated during test.
Water or dust ingress shall be limited enough to prevent deleterious effect to the switch function.
However, IP67 shall be guaranteed under single product state,
then there is a possibility that IP67 performance become impaired depending on your mounting condition or usage.
So, please ask us in advance, if the switch is applied to important usage for water and dust resistant.
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Light Touch Switches/EVPBL
Dimensions in mm (not to scale)
EVPBL
(Embossed Taping)
General dimension tolerance : 0.1
dimensions are reference dimensions.
This reference specifications are subject to change.
(Terminal)
Circuit Diagram
Molding gate
This product is designed to be smaller than the
conventional type, which lowered the film peel off
strength. Therefore please avoid to apply force to
a push plate from side, or/and
avoid set-knob to touch push plate during insertion
to a set-case.
:Recommended land pattern area.
:No soldering area.
Solder thickness t=0.080.01
Any land pattern or via holes shall not be
provided at area.
If it's necessary to design land pattern or
via holes at area.
No soldering please apply resist to them to protect their
metal part completely.
If their metal parts are not protected
completely,short circuit failure may occur
by solder ball.
Beside, there should be convexoconcave by
designing additional pattern,
it may cause swith tilt, influence on
solder-ability or flux intrusion
after reflow soldering.
Therefore, please study any influence of
additional land pattern or via holes at
area in advance.
Part Numbers Operating Force H=Height Operating Life
EVPBL2A1B000 1.6 N 0.53 mm 300,000 cycles
EVPBL9A2B000 2.25 N 0.57 mm 300,000 cycles
2
(Without the remainder of the
molding gate and the film)