Manufacturing Notes for RF5110G The information in this publication is believed to be accurate and reliable. However, no responsibility is assumed by RF Micro Devices, Inc. RFM) for its use, nor for any infringement of patents, or other rights of third parties, resulting from its use. No license is granted by implication or otherwise under any patent or patent rights of RFMD. RFMD reserves the right to change component circuitry, recommended application circuitry and specifications at any time without prior notice. RoHS status based on EUDirective2002/95/EC (at time of this document revision). Table of Contents 1. Introduction . 2 2. Quad Flat Pack Package Description . 2 2.1 RF5110G Outline Drawing 2 2.2 RF5110G Branding Diagram 2 3. Carriers . 3 3.1 Tape and Reel 3 4. Storage and Handling . 4 4.1 ESD . 4 4.2 Moisture Sensitivity Level (MSL) . 4 4.2.1 Storage Conditions . 4 4.2.2 Out-of-Bag Time Duration 4 4.2.3 Baking . 5 5. Assembly Guidelines 6 5.1 Stencil Design Recommendation . 6 5.2 Solder Reflow Recommendation . 7 5.2.1 Solder Reflow Equipment 7 5.2.2 Reflow Profile Notes 7 5.2.3 High Temperature Reflow Profile 7 5.2.4 Solder Paste 8 5.2.5 Inspection 8 6. Part Removal/Rework . 9 6.1 Removal Method 9 6.2 Replacement Method 9 7. Summary Information 10 8. Revision History . 10 RF MICRO DEVICES, RFMD, Optimum Technology Matching, Enabling Wireless Connectivity, PowerStar, POLARIS TOTAL RADIO and UltimateBlue are trademarks of RFMD, LLC. BLUETOOTH is a trade- mark owned by Bluetooth SIG, Inc., U.S.A. and licensed for use by RFMD. All other trade names, trademarks and registered trademarks are the property of their respective owners. 2006, RF Micro Devices, Inc. 1 of 10 7628 Thorndike Road, Greensboro, NC 27409-9421 For sales or technical RF5110G010 support, contact RFMD at (+1) 336-678-5570 or sales-support rfmd.com.RF5110G Manufacturing Notes 1. Introduction This manufacturing note is intended for surface mount technology (SMT) manufacturing engineers who are currently using the RF5110G for prototype or production manufacturing. The information provided in this document is meant to assist customers with the set-up and characterization of their products. 2. Quad Flat Pack Package Description A quad flat pack - no leads (QFN) package consists of a lead frame base containing one or more die attached to a ground pad provided in the center of the package. The leads and ground pad are all made from the same Cu material, using an etch pro- cess that forms the leads and ground pad in predetermined configurations and sizes. The assembled device is then coated with a protective plastic overmold material, which provides mechanical and environmental protection to the package. The input and output terminations for the RF5110G are in the form of Cu leads that are formed around the periphery of the package and are coated with a surface finish (Matte-Sn (tin) 8-20 m thickness). 2.1 RF5110G Outline Drawing NOTES: 1. SHADED PIN IS LEAD 1. 2. DIMENSION APPLIES TO PLATED TERMINAL: TO BE MEASURED BETWEEN .20 & .25mm FROM TERMINAL END. 3. PIN 1 IDENTIFIER MUST EXIST ON TOP SURFACE OF PACKAGE BY IDENTIFICATION MARK OR FEATURE ON THE PACKAGE BODY. EXACT SHAPE AND SIZE IS OPTIONAL. 4. DIE THICKNESS ALLOWABLE IS .305mm MAX. 5. PACKAGE WARPAGE: MAX05mm. 2 PLCS 0.10 C A -A- .10 C A B 3.00 .05 C .90 .30 2 1.50 TYP .85 .18 .60 .70 .24 PIN 1 ID .65 2 PLCS .05 TYP 3 R.20 .00 0.10 C B 12 MAX 1.65 .50 3.00 SQ. 1.35 .30 0.10 C B -B- 2 PLCS .50 -C- 1.37 TYP SEATING PLANE 2.75 SQ 0.10 C A 2 PLCS 2.2 RF5110G Branding Diagram If included on branding diagram, YY indicates year WW indicates work week and Trace Code is a sequential number assigned at device assembly. RF5110G010 2 of 10 7628 Thorndike Road, Greensboro, NC 27409-9421 For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support rfmd.com.