HIP2101EIB Renesas

DATASHEET HIP2101 FN9025 Rev.10.00 100V/2A Peak, Low Cost, High Frequency Half Bridge Driver Aug 8, 2019 The HIP2101 is a high frequency, 100V Half Bridge Features N-Channel power MOSFET driver IC. It is equivalent to the Drives N-Channel MOSFET Half Bridge HIP2100 with the added advantage of full TTL/CMOS compatible logic input pins. The low-side and high-side gate SOIC, EPSOIC, QFN and DFN Package Options drivers are independently controlled and matched to 13ns. SOIC, EPSOIC and DFN Packages Compliant with 100V This gives users total control over dead time for specific Conductor Spacing Guidelines of IPC-2221 power circuit topologies. Undervoltage protection on both the Pb-free Product Available (RoHS Compliant) low-side and high-side supplies force the outputs low. An on-chip diode eliminates the discrete diode required with Bootstrap Supply Max Voltage to 114VDC other driver ICs. A new level-shifter topology yields the On-Chip 1 Bootstrap Diode low-power benefits of pulsed operation with the safety of DC operation. Unlike some competitors, the high-side output Fast Propagation Times for Multi-MHz Circuits returns to its correct state after a momentary undervoltage of Drives 1000pF Load with Rise and Fall Times Typ. 10ns the high-side supply. TTL/CMOS Input Thresholds Increase Flexibility Applications Independent Inputs for Non-Half Bridge Topologies Telecom Half Bridge Power Supplies No Start-Up Problems Avionics DC-DC Converters Outputs Unaffected by Supply Glitches, HS Ringing Below Ground, or HS Slewing at High dv/dt Two-Switch Forward Converters Low Power Consumption Active Clamp Forward Converters Wide Supply Range Related Literature Supply Undervoltage Protection For a full list of related documents, visit our website: 3 Output Driver Resistance HIP2101 device page QFN/DFN Package: - Compliant to JEDEC PUB95 MO-220 QFN - Quad Flat No Leads - Package Outline - Near Chip Scale Package footprint, which improves PCB efficiency and has a thinner profile FN9025 Rev.10.00 Page 1 of 15 Aug 8, 2019 HIP2101 Ordering Information PART NUMBER TEMP. TAPE AND REEL PACKAGE PKG. (Notes 2, 3) RANGE (C) (Units) (Note 1) (RoHS Compliant) DWG. HIP2101IBZ -40 to 125 - 8 Ld SOIC M8.15 HIP2101IBZT -40 to 125 2.5k 8 Ld SOIC M8.15 HIP2101IBZT7A -40 to 125 250 8 Ld SOIC M8.15 HIP2101EIBZ -40 to 125 - 8 Ld EPSOIC M8.15C HIP2101EIBZT -40 to 125 2.5k 8 Ld EPSOIC M8.15C HIP2101IRZ -40 to 125 - 16 Ld 5x5 QFN L16.5x5 HIP2101IRZT -40 to 125 6k 16 Ld 5x5 QFN L16.5x5 HIP2101IR4Z -40 to 125 - 12 Ld 4x4 DFN L12.4x4A HIP2101IR4ZT -40 to 125 6k 12 Ld 4x4 DFN L12.4x4A NOTES: 1. See TB347 for details about reel specifications. 2. Pb-free products employ special Pb-free material sets molding compounds/die attach materials and 100% matte tin plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J-STD-020C. 3. For Moisture Sensitivity Level (MSL), see the HIP2101 device page. For more information about MSL, see TB363. Pinouts HIP2101 (SOIC, EPSOIC) HIP2101IR4 (DFN) HIP2101 (QFN) TOP VIEW TOP VIEW TOP VIEW 1 V 8 LO DD V 1 12 LO DD 16 15 14 13 HB 2 7 V SS EPAD 2 11 NC V SS HO NC NC 3 6 LI 1 12 3 10 NC NC HS HI 4 5 EPAD 2 HB 11 V SS 4 9 HB NC EPAD HO 3 10 LI HO 5 8 LI HS 6 7 HI NC 4 9 NC 576 8 NOTE: EPAD = Exposed PAD. Pin Descriptions SYMBOL DESCRIPTION V Positive Supply to lower gate drivers. De-couple this pin to V . Bootstrap diode connected to HB. DD SS HB High-Side Bootstrap supply. External bootstrap capacitor is required. Connect positive side of bootstrap capacitor to this pin. Bootstrap diode is on-chip. HO High-Side Output. Connect to gate of High-Side power MOSFET. HS High-Side Source connection. Connect to source of High-Side power MOSFET. Connect negative side of bootstrap capacitor to this pin. HI High-Side input. LI Low-Side input. V Chip negative supply, generally will be ground. SS LO Low-Side Output. Connect to gate of Low-Side power MOSFET. EPAD Exposed pad. Connect to ground or float. The EPAD is electrically isolated from all other pins. FN9025 Rev.10.00 Page 2 of 15 Aug 8, 2019 NC NC V HS DD HI LO NC NC