HIP6602B Data Sheet July 22, 2005 FN9076.5 Dual Channel Synchronous Rectified Features Buck MOSFET Driver Drives Four N-Channel MOSFETs The HIP6602B is a high frequency, two power channel Adaptive Shoot-Through Protection MOSFET driver specifically designed to drive four power Internal Bootstrap Devices N-Channel MOSFETs in a synchronous rectified buck converter topology. This device is available in either a Supports High Switching Frequency 14-lead SOIC or a 16-lead QFN package with a PAD to - Fast Output Rise Time thermally enhance the package. These drivers combined with a HIP63xx or ISL65xx series of Multi-Phase Buck PWM - Propagation Delay 30ns controllers and MOSFETs form a complete core voltage Small 14-Lead SOIC Package regulator solution for advanced microprocessors. Smaller 16-Lead QFN Thermally Enhanced Package The HIP6602B drives both upper and lower gates over a range of 5V to 12V. This drive-voltage flexibility provides the 5V to 12V Gate-Drive Voltages for Optimal Efficiency advantage of optimizing applications involving trade-offs Three-State Input for Bridge Shutdown between switching losses and conduction losses. Supply Undervoltage Protection The output drivers in the HIP6602B have the capacity to efficiently switch power MOSFETs at high frequencies. Each Pb-Free Plus Anneal Available (RoHS Compliant) driver is capable of driving a 3000pF load with a 30ns QFN Package: propagation delay and 50ns transition time. This device - Compliant to JEDEC PUB95 MO-220 implements bootstrapping on the upper gates with a single QFN - Quad Flat No Leads - Package Outline external capacitor and resistor required for each power - Near Chip Scale Package footprint, which improves channel. This reduces implementation complexity and allows PCB efficiency and has a thinner profile the use of higher performance, cost effective, N-Channel MOSFETs. Adaptive shoot-through protection is integrated Applications to prevent both MOSFETs from conducting simultaneously. Core Voltage Supplies for Intel Pentium III and AMD TM Ordering Information Athlon Microprocessors. TEMP. PKG. High-Frequency, Low-Profile DC/DC Converters PART NUMBER RANGE (C) PACKAGE DWG. High-Current, Low-Voltage DC/DC Converters HIP6602BCB 0 to 85 14 Ld SOIC M14.15 HIP6602BCB-T 14 Ld SOIC Tape and Reel HIP6602BCBZ (Note 1) 0 to 85 14 Ld SOIC M14.15 (Pb-Free) HIP6602BCBZ-T (Note 1) 14 Ld SOIC Tape and Reel (Pb-Free) HIP6602BCR 0 to 85 16 Ld 5x5 QFN L16.5x5 HIP6602BCR-T 16 Ld 5x5 QFN Tape and Reel HIP6602BCRZ (Note 1) 0 to 85 16 Ld 5x5 QFN L16.5x5 (Pb-Free) HIP6602BCRZ-T (Note 1) 16 Ld 5x5 QFN Tape and Reel (Pb-Free) HIP6602BCRZA (Note 1) 0 to 85 16 Ld 5x5 QFN L16.5x5 (Pb-Free) HIP6602BCRZA-T (Note 1) 16 Ld 5x5 QFN Tape and Reel (Pb-Free) NOTE: 1. Intersil Pb-free plus anneal products employ special Pb-free material sets molding compounds/die attach materials and 100% matte tin plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. CAUTION: These devices are sensitive to electrostatic discharge follow proper IC Handling Procedures. 1 1-888-INTERSIL or 1-888-468-3774 Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright Intersil Americas Inc. 2002-2005. All Rights Reserved All other trademarks mentioned are the property of their respective owners. NOT RECOMMENDED FOR NEW DESIGNS INTERSIL RECOMMENDS: ISL6612, ISL6612A, ISL6613, ISL6613A, ISL6614, ISL6614AHIP6602B Pinouts HIP6602B (SOIC) HIP6602 (16 LD QFN) TOP VIEW TOP VIEW 14 PWM1 11 VCC PWM2 22 13 PHASE1 16 15 14 13 GND 3 12 UGATE1 GND 1 12 UG1 LGATE1 4 11 BOOT1 LG1 2 11 BOOT1 PVCC BOOT2 5 10 PGND PVCC 3 10 BOOT2 UGATE2 6 9 LGATE2 PHASE2 PGND 4 9 UG2 7 8 576 8 Block Diagram PVCC BOOT1 UGATE1 VCC +5V PHASE1 SHOOT- THROUGH 10K PROTECTION PVCC PWM1 LGATE1 10K PGND PGND CONTROL +5V LOGIC PVCC BOOT2 10K UGATE2 PWM2 PHASE2 SHOOT- 10K THROUGH PROTECTION PVCC GND LGATE2 HIP6602B PGND For HIP6602BCR, the PAD on the bottom side of the PAD package MUST be soldered to the PC board FN9076.5 2 July 22, 2005 NC PWM2 LG2 PWM1 PHASE2 VCC PHASE1 NC