Short-Form Datasheet HXR14450 Quad-Channel 56Gbps PAM4 Linear TIA with CDR The HXR14450 is a quad-channel, low power, linear Features trans-impedance amplifier (TIA) with an integrated Quad-channel 56Gbps PAM4 linear TIA clock and data recovery (CDR) unit. It is a member integrated with a low latency CDR of the family of optical receiver transmitter array Low power typical 400mW per channel (ORTA) products for high-speed optical Typical 750mVppd output (adjustable) interconnects. The HXR14450 integrates a linear trans-impedance pre-amplifier, linear post-amplifier, Up to 3 mApp overload CDR unit, and a versatile output stage in one chip Independent, per channel receiver signal strength for higher density and lower power consumption indicator (RSSI) applications. The chip is designed for MMF PMD 5k typical differential gain Short-Reach applications that support 200G per Linear operation with internal automatic gain port with a signaling rate up to 56Gbps PAM4 control (AGC) modulation. In conjunction with the HXT14450 a quad-channel vertical-cavity surface-emitting laser Auto-Adaptive CTLE and DFE (VCSEL) driver with an integrated CDR, one can Programmable 3-tap de-emphasis produce compact quad small form factor QSFP-type Support reference-less and reference clock modules to serve high speed optical interconnects modes in data center applications. On-chip testability: eye opening monitor (EOM), The HXR14450 has a built-in auto-adaptive jitter tolerance (JTOL), PRBS generator, error continuous-time linear equalizer (CTLE) and a checker decision-feedback equalizer (DFE), which can work Support both isolated and common cathode in chip-to-module and chip-to-chip interconnects. photo-detector (PD) arrays The chipsets provide on-chip testability such as 2 I C interface control: standard and fast modes PRBS generator and error checker. Applications Designed for direct DC-coupled die with on-board optics (OBO) and with a small number of additional 200G QSFP56 SR4 and 400G QSFP-DD or components for cost-effective and compact OSFP SR8 Ethernet Modules and AOC assemblies, this chipset enables lower power and 400G OBO Modules compact modules for high density and high Support CEI-56G-VSR-PAM4 bandwidth applications in hyper-scale data center applications. X0010046 Rev.2.0 Page 1 Feb.3.21 Copyright 2021 HXR14450 Short-Form Datasheet Orderable Part Number Temperature Range Dimensions 1 HXR14450-DNU -5C to +95C Die: 3428.2 1398.4 200m HXX14450-EVB Room Temperature - 1. Waffle pack. For price, delivery schedules, and to place orders, please contact Renesas at www.renesas.com/us/en/buy- sample/locations. X0010046 Page 2 Feb.3.21