DATASHEET
ISL71001M
FN8926
Rev. 1.00
6A Synchronous Buck Regulator with Integrated MOSFETs
Mar 26, 2018
The ISL71001M is a radiation tolerant and high
Features
efficiency monolithic synchronous buck regulator with
Passes NASA low outgassing specifications
integrated MOSFETs. This single chip power solution
Operates from 3V to 5.5V supply
operates across an input voltage range of 3V to 5.5V and
provides a tightly regulated output voltage that is
Programmable power-on reset level
externally adjustable from 0.8V to ~85% of the input
Current mode control for excellent dynamic response
voltage with an output load current capacity of 6A. The
ISL71001M is available in a plastic 64 Ld Thin Quad Fixed 1MHz switching frequency
Flatpack (EP-TQFP) package.
1.2% reference voltage
The ISL71001M uses peak current-mode control for
Thermally enhanced heat-sink plastic package
excellent output load transient response and features
Highly efficient: 95% peak efficiency
integrated compensation and switches at a fixed
frequency of 1MHz to reduce component size and count.
Bidirectional SYNC pin allows two devices to be
In applications where two regulators are needed, two
synchronized 180 out-of-phase
ISL71001M devices can be synchronized 180
Adjustable output voltage
out-of-phase to reduce the overall input RMS ripple
current. The internal synchronous power switches are
Analog soft-start
optimized for high efficiency and good thermal
Output undervoltage and output overcurrent
performance.
protection
The ISL71001M incorporates fault protection for the
Power-good output voltage monitor
regulator. The protection circuits include input
Tin (Sn) free lead finish
undervoltage, output undervoltage, and output
overcurrent.
Characterized radiation level
High integration makes the ISL71001M an ideal choice
30krad(Si) at a low dose rate
to power many of todays small form factor applications.
2
Single-event effects at LET = 43MeVcm /mg
Two devices can be synchronized to provide a complete
power solution for large scale digital ICs, like Field
Applications
Programmable Gate Arrays (FPGAs), that require
FPGA, CPLD, DSP, CPU Core, or I/O voltages
separate core and I/O voltages.
Low-voltage, high-density distributed power systems
Related Literature
Low Earth Orbit (LEO) applications
For a full list of related documents, visit our website
High altitude avionics
ISL71001M product page
Launch vehicles
100
95
3.3V
ISL71001M
CORE
90
SYNC
SYNC 85
ISL71001M I/O FPGA
80
75
LDO AUX
3.3VIN 5VIN
70
01 23 4 5 6
I (A)
OUT
Figure 1. Typical Application Figure 2. Efficiency vs V for 2.5V Output, T = +25C
IN C
FN8926 Rev. 1.00 Page 1 of 32
Mar 26, 2018
Efficiency (%)ISL71001M
Contents
1. Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1 Typical Application Schematics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.2 Functional Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.3 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.4 Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
1.5 Pin Descriptions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2. Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.1 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.2 Outgas Testing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.3 Thermal Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.4 Recommended Operation Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.5 Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3. Typical Operating Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
4. Device Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
4.1 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
4.2 Operation Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
4.3 Fault Monitoring and Protection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
4.4 Feedback Loop Compensation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
4.5 Component Selection Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
5. PCB Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
5.1 PCB Plane Allocation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
5.2 PCB Component Placement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
5.3 PCB Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
5.4 Package Thermal Management. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
6. Radiation Tolerance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
6.1 Total Ionizing Dose (TID) Testing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
6.2 Data Plots . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
6.3 Single-Event Effects Testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
7. Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
8. Package Outline Drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
FN8926 Rev. 1.00 Page 2 of 32
Mar 26, 2018