X-On Electronics has gained recognition as a prominent supplier of M30042040054X0IWAR MRAM across the USA, India, Europe, Australia, and various other global locations. M30042040054X0IWAR MRAM are a product manufactured by Renesas. We provide cost-effective solutions for MRAM, ensuring timely deliveries around the world.

M30042040054X0IWAR Renesas

M30042040054X0IWAR electronic component of Renesas
Product Image X-ON
Product Image X-ON
Product Image X-ON

Images are for reference only
See Product Specifications
Part No.M30042040054X0IWAR
Manufacturer: Renesas
Category: MRAM
Description: MRAM M300420400540IW 4MB HIGH PERFORMANCE QSPI 54MHZ IND MRAM
Datasheet: M30042040054X0IWAR Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
N/A

Availability Price Quantity
0
MOQ : 4000
Multiples : 4000
4000 : USD 10.2492
N/A

   
Manufacturer
Product Category
Series
Packaging
Hts Code
LoadingGif
 
Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the M30042040054X0IWAR from our MRAM category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the M30042040054X0IWAR and other electronic components in the MRAM category and beyond.

Image Part-Description
Stock Image QB-78K0KC2L-TB
MCU Test Board Connect To QB-Mini2 On-Chip Debugging Emulator
Stock : 36
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image QB-78K0IB2-TB
Emulators/Simulators 78K0/IB2 TARGET BOARD
Stock : 53
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image QB-78K0RIE3-TB
Embedded System Development Boards and Kits
Stock : 57
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image QB-78K0RKG3-TB
MCU Test Board Connect To QB Mini2 On Chip Debugging Emulator
Stock : 48
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image F2970EVBI
RF Development Tools F2970, 75 ohm SPDTA RF Switch Eval board
Stock : 2
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image YSAEWIFI-1
WiFi Development Tools (802.11) Synergy Wi-Fi kit
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image YCONNECT-IT-I-RJ4501
RF Development Tools Industrial Ethernet RJ45 Solution Kit
Stock : 4
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image RTK00WFMX0B00000BE
WiFi Development Tools 802.11 Silex Pmod Modulefor EU Japan
Stock : 10
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image F1951EVS
RF Development Tools F1951 6-bit Eval RF Switch
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image F1956EVS
RF Development Tools F1956 7-bit Eval RF Switch
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Image Part-Description
Stock Image MR25H40CDF
Memory; MRAM; SPI; 512kx8bit; 4Mbit; 25ns; DFN8; Mounting: SMD; 40MHz
Stock : 1128
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Hot Stock Image MR25H10CDF
Memory; MRAM; SPI; 128kx8bit; 1Mbit; DFN8; Mounting: SMD; 2.7÷3.6VDC
Stock : 445
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image MR4A08BCMA35
NVRAM MRAM Parallel 16Mbit 3.3V 48-Pin FBGA Tray
Stock : 466
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image MR25H256ACDF
MRAM 256Kb 3.3V 32Kx8 SPI
Stock : 34
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image MR4A08BUYS45
MRAM 16Mb 3.3V 45ns 2Mx8 Parallel MRAM
Stock : 131
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image MR25H128ACDF
MRAM 128Kb 3.3V 16Kx8 SPI
Stock : 529
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image MR25H128APDF
MRAM 128Kb 3.3V 16Kx8 SPI
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image MR0D08BMA45R
RAM RAM 1Mb (128K x 8) Parallel BGA-48 RoHS
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image AS3001204-0054X0IWAY
MRAM Avalanche High Performance Serial P-SRAM 1Mb in WSON8 package with QSPI - 54MHz interface, 3V, -40 C to 85 C
Stock : 767
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image AS3001204-0054X0ISAY
MRAM Avalanche High Performance Serial P-SRAM 1Mb in SOIC8 package with QSPI - 54MHz interface, 3V, -40 C to 85 C
Stock : 313
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.

High Performance M1004204/M1008204/M1016204 Serial MRAM Memory M3004204/M3008204/M3016204 Description Features Mxxxx204 is a magneto-resistive random-access memory Interface (MRAM). It is offered in density ranging from 4Mbit to 16Mbit. Serial Peripheral Interface QSPI (4-4-4) MRAM technology is analogous to Flash technology with SRAM Single Data Rate Mode: 108MHz compatible read/write timings (Persistent SRAM, P-SRAM). Data is Double Data Rate Mode: 54MHz always non-volatile. Technology 40nm pMTJ STT-MRAM MRAM is a true random-access memory allowing both reads and writes to occur randomly in memory. MRAM is ideal for applications Virtually unlimited Endurance and Data Retention (see that must store and retrieve data without incurring large latency Endurance and Data Retention specification on page 38) penalties. It offers low latency, low power, virtually infinite Density endurance and retention, and scalable non-volatile memory 4Mb, 8Mb, 16Mb technology. Operating Voltage Range VCC: 1.71V 2.00V Mxxxx204 is available in small footprint 8-pad DFN (WSON) and 8- VCC: 2.70V 3.60V pin SOIC packages. These packages are compatible with similar low-power volatile and non-volatile products. Operating Temperature Range Industrial: -40C to 85C Mxxxx204 is offered with industrial (-40C to 85C) and industrial Industrial Plus: -40C to 105C plus (-40C to 105C) operating temperature ranges. Packages 8-pad DFN (WSON) (5.0mm x 6.0mm) 8-pin SOIC (5.2mm x 5.2mm) Typical Applications Data Protection Ideal for applications that must store and retrieve data Hardware Based: Write Protect Pin (WP ) without incurring large latency penalties. Software Based: Address Range Selectable through Configuration bits (Top/Bottom, Block Protect 2:0 ) Factory Automation Identification Multifunction Printers 64-bit Unique ID Industrial Control And Monitoring 64-bit User Programmable Serial Number Medical Diagnostics Augmented Storage Array Data Switches And Routers 256-byte User Programmable with Write Protection Supports JEDEC Reset RoHS Compliant Block Diagram CS V Address Register CC Status Register Serial I/Os Column Decoder Command Register SO / IO 1 IO 3 MRAM MRAM MRAM Array WP / IO 2 Array CLK Command Array & Control High Voltage Generator V SI / IO 0 SS Regulator Data Buffer Feb.25.21 Page 1 Row Decoder M1004204/M1008204/M1016204 M3004204/M3008204/M3016204 Contents 1. Performance ............................................................................................................................................................................................3 2. General Description ...............................................................................................................................................................................3 3. Ordering Options ....................................................................................................................................................................................4 3.1 Valid Combinations Standard .........................................................................................................................................................4 4. Signal Description and Assignment ..................................................................................................................................................7 5. Package Options ....................................................................................................................................................................................9 5.1 8-Pad DFN (WSON) (Top View) ..........................................................................................................................................................9 5.2 8-Pin SOIC (Top View) ........................................................................................................................................................................9 6. Package Drawings ...............................................................................................................................................................................10 6.1 8-Pad DFN (WSON) ..........................................................................................................................................................................10 6.2 8-Pin SOIC ........................................................................................................................................................................................11 7. Architecture ............................................................................................................................................................................................12 8. Device Initialization ..............................................................................................................................................................................14 9. Memory Map ..........................................................................................................................................................................................16 10. Augmented Storage Array Map .......................................................................................................................................................16 11. Register Addresses .............................................................................................................................................................................16 12. Register Map..........................................................................................................................................................................................17 12.1 Status Register / Device Protection Register (Read/Write) ...............................................................................................................17 12.2 Augmented Storage Array Protection Register (Read/Write) ............................................................................................................18 12.3 Device Identification Register (Read Only) ........................................................................................................................................19 12.4 Serial Number Register (Read/Write) ................................................................................................................................................19 12.5 Unique Identification Register (Read Only) .......................................................................................................................................19 12.6 Configuration Register 1 (Read/Write)...............................................................................................................................................20 12.7 Configuration Register 2 (Read/Write)...............................................................................................................................................21 12.8 Configuration Register 3 (Read/Write)...............................................................................................................................................23 12.9 Configuration Register 4 (Read/Write)...............................................................................................................................................23 13. Instruction Set ........................................................................................................................................................................................24 14. Instruction Description and Structures ...........................................................................................................................................27 15. Electrical Specifications ......................................................................................................................................................................38 15.1 CS Operation & Timing ....................................................................................................................................................................42 15.2 Data Output Operation & Timing .......................................................................................................................................................44 15.3 WP Operation & Timing ...................................................................................................................................................................45 Enter Deep Power Down Command (EDP B9h) ............................................................................................................................46 Exit Deep Power Down Command (EXDPD - ABh) ..........................................................................................................................47 Enter Hibernate Command (EHBN BAh) ........................................................................................................................................48 16. Thermal Resistance .............................................................................................................................................................................49 17. Revision History ....................................................................................................................................................................................50 Feb.25.21 Page 2

Tariff Desc

8542.32.00 33 No ..Memory cards (other than "smart" cards and SIMM), which incorporate E2PROM, SRAM, DRAM or flash memory (for example, for PCMCIA applications)
ID4
IDT
IDT, Integrated Device Technology Inc
INTEGRATED DEVICE
INTEGRATED DEVICE TECHNOLOGY
INTEGRATED DEVICES TECH AID
Intersil
INTERSIL - FGC
Intersil(Renes as Electronics)
Intersil(Renesas Electronics)
ITS
REA
RENESAS
RENESAS (IDT)
RENESAS (INTERSIL)
Renesas / IDT
Renesas / Intersil
Renesas Electronics
Renesas Electronics America
RENESAS TECHNOLOGY
Supplier of the E-TDA7377 Audio Amplifier in USA, India, Australia image

Jul 8, 2024

Xon Electronics has distinguished itself as a premier supplier of the E-TDA7377, a highly sought-after audio amplifier IC manufactured by STMicroelectronics. With a strong presence in the USA, India,

Linear Voltage Regulator image

Nov 29, 2021
Uncover the advantages of a linear voltage regulator in maintaining a constant voltage supply. Improve your devices' performance. Upgrade now for seamless power management!
Best Supplier of DSPIC33EP64GP502-ISP In USA, India, Australia image

Jul 1, 2024

One such essential component is the DSPIC33EP64GP502-ISP from Microchip Technology, a part of their Digital Signal Processors & Controllers (DSP, DSC) lineup. This article explores why Xon Electronic stands out as the best supplier for this p

What is Circular MIL Spec Backshells image

Aug 29, 2024
Circular MIL Spec Backshells are essential components used in aerospace, military, industrial, and marine applications to protect electrical connections from environmental factors. Made from durable materials like aluminum and stainless steel, they provide strain relief, durability, and environment

Looking for help? Visit our FAQ's Section to answer to all your questions

 

X-ON Worldwide Electronics

Welcome To X-ON Electronics
For over three decades, we have been advocating and shaping the electronic components industry. Our management complements our worldwide business scope and focus. We are committed to innovation, backed by a strong business foundation. If you need a trustworthy supplier of electronic components for your business – look no further.
 

Copyright ©2024  X-ON Electronics Services. All rights reserved.
Please ensure you have read and understood our Terms & Conditions before purchasing. All prices exclude GST.

Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted AS9120 Certified