M3008316045NX0IBCY Renesas

Parallel MRAM M3004316/M3008316 Memory x16 /M3016316/M3032316 Description Features M3xxx316 is a magneto-resistive random-access Interface memory (MRAM). It is offered in density ranging from Parallel Asynchronous x16 4Mbit to 32Mbit. MRAM technology is analogous to Technology Flash technology with SRAM compatible 35ns/35ns 40nm pMTJ STT-MRAM and 45ns/45ns read/write timings (Persistent SRAM, Data Retention (see Table 16. Endurance P-SRAM). Data is always non-volatile. This makes and Data Retention Density) MRAM a very reliable and fast non-volatile memory 4Mb, 8Mb, 16Mb, 32Mb solution. Operating Voltage Range VCC: 2.70V 3.60V MRAM is a true random-access memory allowing both Operating Temperature Range reads and writes to occur randomly in memory. MRAM Industrial: -40C to 85C is ideal for applications that must store and retrieve Industrial Plus: -40C to 105C data without incurring large latency penalties. It offers low latency, low power, virtually unlimited endurance RoHS Compliant & REACH Compliant and data retention, high performance and scalable Packages memory technology. 44-pin TSOP (10mm x 18mm) 54-pin TSOP (10mm x 22mm) M3xxx316 is offered with industrial (-40C to 85C) 48-ball FBGA (10mm x 10mm) and industrial plus (-40C to 105C) operating Memory Array Organization temperature ranges. 4Mbit 262,144 x 16 Typical Applications 8Mbit 524,288 x 16 Ideal for applications that must store and retrieve data without incurring large latency penalties 16Mbit 1,048,576 x 16 Factory Automation 32Mbit Multifunction Printers 2,097,152 x 16 Industrial Control And Monitoring Medical Diagnostics Data Switches And Routers Smart Meter Block Diagram Address ADDR 20:0 Control Column Decoder I/O DQ 15:0 Control E MRAM G Command Array W & UB Control LB SenseAmps Sep.3.21 Page 1 Row DecoderParallel MRAM M3004316/M3008316 Memory x16 /M3016316/M3032316 Contents Features .................................................................................................................................... 1 Performance ............................................................................................................................. 3 General Description ................................................................................................................. 4 Ordering Options ..................................................................................................................... 5 Valid Combinations Standard ......................................................................................... 6 Signal Description and Assignment ....................................................................................... 8 Package Options ...................................................................................................................... 9 44-Pin TSOP (4Mb) (Top View) ............................................................................................. 9 54-Pin TSOP (4-16Mb) (Top View) ....................................................................................... 9 48-Ball FBGA (4-32Mb) (Balls Down, Top View) ................................................................. 9 Package Drawings ..................................................................................................................11 44-Pin TSOP .........................................................................................................................11 54-Pin TSOP .........................................................................................................................12 48-Ball FBGA .......................................................................................................................13 Architecture .............................................................................................................................14 Device Initialization .................................................................................................................15 Electrical Specifications .........................................................................................................17 Write Operation .......................................................................................................................19 Bus Turnaround Operation Read to Write ..........................................................................21 Read Operation .......................................................................................................................22 Endurance and Data Retention ..............................................................................................23 Thermal Resistance ................................................................................................................24 Revision History ......................................................................................................................25 Sep.3.21 Page 2