5W, Qi Wireless Power Receiver with Integrated P9025AC Rectifier and LDO Output DATASHEET Features Introduction Integrated Single Chip Receiver (Rx) Solution The P9025AC is an integrated single-chip, WPC-1.1.2 compliant wireless power receiver with an advanced Foreign Integrated Full-Bridge Synchronous Rectifier Object Detection (FOD) feature. This device operates with an Integrated 5.3V, 1A LDO Regulator Output AC power signal from a resonant tank and converts it into a WPC-1.1.2 compliant regulated 5.3V output voltage. The receiver includes a high Advanced WPC v1.1.2 Foreign Object Detection (FOD) efficiency Synchronous Full Bridge Rectifier and 5.3V tracking Programmable FOD setting via external resistor LDO output stage. The P9025AC automatically detects the Closed-loop power transfer control between Tx and Rx transmitters presence and initiates WPC AC modulation 2 communication protocols with optimal efficiency. Support I C interface with access to: Rectifier voltage The device includes the control circuit required to modulate Output current the load to transmit WPC-compliant message packets to the Resonance frequency base station. It uses minimal external components to reduce Open-Drain LED Indicator Output overall solution area and costs. Over-Temperature/Voltage/Current Protection The P9025AC employs advanced programmable WPC FOD 0 to +85C temperature range techniques to detect foreign metallic objects placed on the 5 x 5 mm 32-VFQFPN package transmitter base station derived from a transmitted and received power transfer algorithm. Applications PC peripherals Rugged electronic gear Small appliances Battery-powered electronics Typical Application Circuit P9025AC BST1 V =5.3V OUT C BST1 OUT CLAMP1 SNS C CLAMP1 C OUT ACM1 C R S lim C MOD1 AC1 ILIM L RX C D AC2 R 1 C MOD2 STAT ACM2 R FOD1 C CLAMP2 FOD1 CLAMP2 FOD2 R FOD2 C BST2 BST2 Temperature TEOP Sense VDD INT C Interupt 1 VRECT C RECT EN Enable SCL SCL CHG END/CS100 SDA SDA Charge AGND PGND Complete P9025AC 09/01/15 1 2015 Integrated Device Technology, Inc.P9025AC DATASHEET Absolute Maximum Ratings Stresses above the ratings listed below (Table 1 and Table 2) can cause permanent damage to the P9025AC. These ratings, which are standard values for IDT commercially rated parts, are stress ratings only. Functional operation of the device at these or any other conditions above those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods can affect product reliability. Electrical parameters are guaranteed only over the recommended operating temperature range. Table 1: Absolute Maximum Ratings Summary Pins Rating Units AC1, AC2, VRECT, ACM1, ACM2, CLAMP1, CLAMP2 to PGND -0.3 to 20 V BST1, BST2 to PGND1 -0.3 to (AC1, AC2 + 6) V INT, EN, STAT, SCL, SDA, OUT, SNS, TEOP, RLIM, CHG END/CS100, FOD1, FOD2, VDD to AGND -0.3 to 6 V PGND, PGND1, PGND2, to AGND -0.3 to 0.3 V Out Current 1.5 A AC1, AC2 Current 2A RMS 1,2,3,4 Table 2: Package Thermal Information Symbol Description Rating (VFQFPN) Units Thermal Resistance Junction to Ambient 35 C/W JA Thermal Resistance Junction to Case 29.6 C/W JC Thermal Resistance Junction to Board 2.4 C/W JB T Operating Junction Temperature 0 to +125 C J T Ambient Operating Temperature 0 to +85 C A T Storage Temperature -55 to +150 C STG T Lead Temperature (soldering, 10s) 300 C LEAD NOTES: 1. The maximum power dissipation is PD(MAX) = (TJ(MAX) - TA) / JA where TJ(MAX) is 125C. Exceeding the maximum allowable power dissipation will result in excessive die temperature, and the device will enter thermal shutdown. 2. This thermal rating was calculated on JEDEC 51 standard 4-layer board with dimensions 3 x 4.5 in still air conditions. 3. Actual thermal resistance is affected by PCB size, solder joint quality, layer count, copper thickness, air flow, altitude, and other unlisted variables. 4. For the NBG32 package, connecting the 5 mm X 5 mm EP to internal/external ground planes with a 5x5 matrix of PCB plated-through-hole (PTH) vias, from top to bottom sides of the PCB, is recommended for improving the overall thermal performance. Table 3: ESD Information Test Model Pins Ratings Units HBM All pins 1500 V CDM All pins 500 V 5W, QI WIRELESS POWER RECEIVER WITH INTEGRATED RECTIFIER AND LDO OUTPUT 2 09/01/15