Wireless Power Receiver P9027LP-R Datasheet for 3W Applications Description Features 2 The P9027LP-R is a highly integrated, low Bill-of-Materials (BOM) Small solution area: ~32mm count, single-chip receiver targeted for 0.5 to 3 W applications. Patented over-voltage protection clamp eliminating external Using the magnetic inductive charging technology, it converts an capacitors AC power signal from a resonant tank into a regulated Optimized for 0.5 to 3 W applications programmable DC output voltage ranging from 4.5 to 6.0 Volts. Integrated low dropout tracking LDO The receiver has a patented internal scheme for communication Low synchronous rectifier R for high efficiency DS(ON) and modulation using zero external components. As a result, it Programmable rectifier voltage for optimal transient response provides an extremely small application area. Together with the versus efficiency P9235A-R transmitter, the P9027LP-R is a complete wireless Integrated charge pump for startup under weak coupling or power system solution. poor alignment The P9027LP-R is available in a WLCSP-40 package (2.24 mm Programmable output voltage: 4.5 to 6.0 V 3.62 mm, 0.4 mm pitch), and it is rated for 0 to 85C ambient Programmable current limit operating temperature range. Open-drain interrupt flag Power transfer LED indicator Typical Applications Dedicated remote temperature sensing Smart Watches Active low enable pin for electrical on/off Headsets 2 I C interface Digital Cameras 0 to +85C ambient operating temperature range Portable Medical Applications WLCSP 2.24 mm X 3.62 mm, 40 pin package Figure 1. Typical Applications Circuit P9027LP-R C FLY1 V RECT C FLY C RECT V DD C FLY2 C VDD L X1 V =5V OUT L RX OUT C d OUTSNS C OUT L X2 R 1 Interupt INT ACT EN Chip Enable TS1 End of Charge EOC R TS1 SCL SCL TS2 R TS2 SDA SDA V SET V HDR IOC R HDR R IOC AGND PGND 2016 Integrated Device Technology, Inc 1 April 28, 2016 P9027LP-R Datasheet Absolute Maximum Ratings Stresses greater than those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. 1,2 Table 1. Thermal Information Pins Rating Units RECT, OUT, OUTSNS -0.3 to 9.0 V LX1, LX2 -0.8 to 9.0 V PGND, AGND -0.3 to 0.3 V VDD, CFLY1, CFLY2, SDA, SCL, EN, AC T, IOC, VSET, VHDR, I NT, EOC, TS1, TS2, -0.3 to 6.0 V Maximum input current into SFBR 3.0 A All voltages here are measured with respect to analog ground pin (AGND). 1,2 Table 2. Thermal Symbol Information Symbol Description Rating Units Thermal Resistance (WLCSP-40) 71 C/W JA Thermal Resistance Junction to Case 18 C/W JC T Ambient Operating Temperature Range 0 to 85 A C T Junction Operating Temperature Range 0 to 125 J C T Junction Storage Temperature Range -55 to 150 Js C T Maximum Soldering Temperature (at Leads) 300 LEAD C Notes: 1. The maximum power dissipation is P = (T )-T )/ where T is 125C. Exceeding the maximum allowable power D(MAX) J(MAX A JA J(MAX) dissipation will result in excessive die temperature, and the device will enter thermal shutdown. 2. The thermal rating was calculated based on a JEDEC 51 standard 4-layer board, 6 vias with dimensions 4 in 4.5 in still air conditions. Actual thermal resistance will be affected by PCB size, solder joint quality, PCB layer count, copper thickness, air flow, altitude, and other unlisted variables. Table 3. ESD Information Test Model Pins Rating Units HBM All 2,000 V CDM All 500 V 2016 Integrated Device Technology, Inc 2 April 28, 2016