Tx High and Low Side N-Channel Gate Driver Product Datasheet IDTP9090 Features Description The IDTP9090 is a high-performance dual-PWM-input MOSFET Input Voltage Range: 4.5 to 5.5 driver for wireless power and general-purpose applications. It is Output Voltage Range: Control Range 0-30V designed to interface directly with a power controller IC and provide a 5V gate drive to two separately-controlled power Peak MOSFET Drive current into 3nF MOSFETs. The IDTP9090 contains one ground-referred LGDRV Sink 3A MOSFET driver and one floating MOSFET driver capable of floating up to 30V. LGDRV Source 1A The IDTP9090 is available in an 8-lead 3mm x 3mm QFN UGDRV Sink 1A package. UGDRV Source 0.8A Static Current (inputs at 0V) 175 A Typical Application Circuit No-load, 250kHz current 1.3mA +5V On-chip boost Schottky diode Dual Independent Schmitt trigger inputs with ~2V VIN BOOST 1 47nF hysteresis and 28 A pull downs UGIN UGDRV 2 UG LOGIC 8 3.4V UVLO with 0.4V of hysteresis for sequencing UGRTN 7 with controller UVLO 24ns nominal propagation delays VCC 5 LGDRV 0.1uF LGIN 6 4 LG LOGIC GND Not All Blocks and Connections Are Shown 3 For General Reference Purposes Only Not To Scale Applications Wireless Power Gate Driver Package: NLG8 QFN-8 3x3-8 QFN General Purpose MOSFET driver (See page 9) Custom ASIC Power Logic Buffer Motor Driver Ordering Information PART AMBIENT TEMP. SHIPPING MARKING PACKAGE QUANTITY NUMBER RANGE CARRIER P9090-0NLGI P9090I NLG8 - QFN-8 3x3x1mm -40C to +125C Tube 25 P9090-0NLGI8 P9090I NLG8 - QFN-8 3x3x1mm -40C to +125C Tape and Reel 2,500 Revision 1.1.1 1 2013 Integrated Device Technology, Inc. IDTP9090 0 Product Datasheet Absolute Maximum Ratings These absolute maximum ratings are stress ratings only. Stresses greater than those listed below (Table 1 and Table 2) may cause permanent damage to the device. Functional operation of the IDTP9090 at maximum ratings is not implied. Continuous application of the absolute maximum rating conditions affects device reliability. Table 1. Absolute Maximum Ratings. All voltages are referred to ground, unless otherwise noted. PINS RATING UNITS VCC, UGIN, LGDRV, LGIN, -0.3 to 6 V UGRTN -0.3 to 30 V BOOST, UGDRV -0.3 to 35 V BOOST to UGRTN -0.3 to 6 V UGDRV to UGRTN -0.3 to 6 V Table 2. Package Thermal Information SYMBOL DESCRIPTION RATING UNITS 119.6 Thermal Resistance Junction to Ambient (NLG8 - QFN) C/W JA 131.84 Thermal Resistance Junction to Case (NLG8 - QFN) C/W JC 2 Thermal Resistance Junction to Board (NLG8 - QFN) 13.4 JB C/W TJ Junction Temperature -40 to +150 C T Ambient Operating Temperature -40 to +125 A C TSTG Storage Temperature -55 to +150 C T Lead Temperature (soldering, 10s) +300 LEAD C Note 1: The maximum power dissipation is P = (T - T ) / where T is 150C. Exceeding the maximum allowable power D(MAX) J(MAX) A JA J(MAX) dissipation will result in excessive die temperature, and the device will enter thermal shutdown. Note 2: This thermal rating was calculated on the JEDEC 51 standard 4-layer board with dimensions 3 x 4.5 in still air conditions. Note 3: Actual thermal resistance is affected by PCB size, solder joint quality, layer count, copper thickness, air flow, altitude, and other unlisted variables. Note 4: For the NTG8 package, connecting the 1.1 mm X 1.1 mm EP to internal/external ground planes with a 2x2 matrix of PCB plated-through- hole (PTH) vias, from top to bottom sides of the PCB, is recommended for improving the overall thermal performance. Table 3. ESD Information TEST MODEL PINS RATINGS UNITS HBM All 1500 V CDM All 500 V Revision 1.1.1 2013 Integrated Device Technology, Inc. 2