Wireless Power Transmitter P9242-R for 15W Applications Datasheet Description Features The P9242-R is a highly integrated, magnetic induction, wireless Power transfer up to 15W power transmitter supporting up to 15W. The system-on-chip Wide input voltage range: 4.25V to 21V operates with an input voltage range of 4.25V to 21V. WPC-1.2 compliant, MP-A2 coil configuration The transmitter includes an industry-leading 32-bit ARM Cortex- Integrated step-down switching regulator M0 processor offering a high level of programmability while Embedded 32-bit ARM Cortex-M0 processor consuming extremely low standby power. The P9242-R features Integrated drivers for external power FETs two LED outputs with pre-defined user-programmable blinking patterns, buzzer, and programmable over-current protection Simultaneous voltage and current demodulation scheme for supporting a wide range of applications. The I2C serial communication communication allows the user to read information such as voltage, Integrated current sense amplifier current, frequency, and fault conditions. The P9242-R includes an Low standby power under-voltage lockout and thermal management circuit to safe Dedicated remote temperature sensing guard the device under fault conditions. Together with the P9221- R receiver (R ), the P9242-R is a complete wireless power system Programmable current limit X solution. Power transfer LED indicator The P9242-R is available in a lead-free, space-saving 48-VFQFN User programmable foreign objects detection (FOD) package. The product is rated for a -40C to +85C operating Pre-defined user-programmable LED pattern temperature range. Active-LOW enable pin for electrical on/off Over-current and over-temperature protection Typical Applications Supports I2C interface Charging pad -40 to +85C ambient operating temperature range Accessories 48-VFQFN (6 u 6 mm) RoHS-compliant package Cradle Tablets Basic Application Circuit R SNS 12V Peak detector GH BRG1 C P L SW BRG1 SW S GL BRG1 VIN LDO LDO33 P9242-R LDO18 PREG GH BRG2 SW BRG2 L P Programming ILIM/FOD GL BRG2 LED/Q-fact resistors 2018 Integrated Device Technology, Inc 1 January 16, 2018 VIN CSP GND LED1 CSN VDEM1 LED2 Coil AssemblyP9242-R Datasheet Contents 1. Pin Assignments ...........................................................................................................................................................................................5 2. Pin Descriptions ............................................................................................................................................................................................6 3. Absolute Maximum Ratings ..........................................................................................................................................................................8 4. Electrical Characteristics ..............................................................................................................................................................................9 5. Typical Performance Characteristics ..........................................................................................................................................................11 6. Function Block Diagram .............................................................................................................................................................................13 7. Theory of Operation ....................................................................................................................................................................................14 7.1 Foreign Object Detection ...................................................................................................................................................................14 7.2 Configuring Foreign Object Detection and Over-Current Limit ILIM/FOD Pin ................................................................................14 7.3 Enable Pin EN ................................................................................................................................................................................16 7.4 Buzzer BUZR Pin ...........................................................................................................................................................................16 7.5 Voltage Demodulation VDEM1 Pin.................................................................................................................................................16 7.6 Current Demodulation IDEMI .........................................................................................................................................................16 7.7 Thermal Protection ............................................................................................................................................................................17 7.8 External Temperature Sensing TS .................................................................................................................................................17 7.9 Q-Factor and LED Pattern Selection LED/Q-Fact Pin ....................................................................................................................18 7.10 Input Voltage Requirement ................................................................................................................................................................19 7.11 Integrated Step-Down Regulator .......................................................................................................................................................19 7.12 Integrated Linear Regulators PREG, LDO33, and LDO18 .............................................................................................................19 7.13 Under-Voltage Lock-Out (UVLO) Protection ......................................................................................................................................19 7.14 LC Resonant Circuit ..........................................................................................................................................................................20 8. Wireless Communication Interface .............................................................................................................................................................21 8.1 Modulation/Communication ...............................................................................................................................................................21 8.2 Bit Decoding Scheme for ASK ...........................................................................................................................................................22 8.3 Byte Decoding for ASK ......................................................................................................................................................................22 8.4 Packet Structure ................................................................................................................................................................................22 9. WPC Mode Characteristics ........................................................................................................................................................................23 9.1 Selection Phase .................................................................................................................................................................................23 9.2 Ping Phase (Digital Ping) ...................................................................................................................................................................23 9.3 Identification and Configuration Phase ..............................................................................................................................................24 9.4 Negotiation Phase .............................................................................................................................................................................24 9.5 Calibration Phase ..............................................................................................................................................................................24 9.6 Power Transfer Phase .......................................................................................................................................................................24 10. Functional Registers ...................................................................................................................................................................................25 10.1 I2C Interface ......................................................................................................................................................................................25 10.2 Register Addresses and Definitions ..................................................................................................................................................26 11. Application Information ...............................................................................................................................................................................29 11.1 Power Dissipation and Thermal Requirements .................................................................................................................................29 2018 Integrated Device Technology, Inc 2 January 16, 2018