Tsi382 PCIe to PCI Bridge Product Brief Features Benefits Enhances system performance by delivering high throughput and General low latency across bridge PCI Express to PCI bridge Simplifies system design by offering numerous programmable Transparent, Non-transparent and Opaque modes features Efficient queuing and buffering for low latency and high throughput BGA Package Compliant with the following specifications: Minimizes board space due to small footprint PCI Express Base 1.1 PCI Express PCI/PCI-X Bridge 1.0 LQFP Package PCI-to-PCI Bridge Architecture 1.2 Simplifies board layout by minimizing PCB layer requirements PCI Local Bus 3.0 Reduces manufacturing and board costs PCI Bus Power Management Interface 1.2 Device Overview PCI Express The IDT Tsi382 is a high-performance bus bridge that connects the x1 lane PCIe Interface PCI Express protocol to the PCI bus standard. The Tsi382s PCIe Inter- Advanced error reporting capability face supports a x1 lane configuration, which enables the bridge to offer End-to-end CRC check and generation throughput performance of up to 2.5 Gbps per transmit and receive Up to four outstanding memory reads direction. ASPM L0 link state power management Legacy interrupt signaling and MSI interrupts The devices PCI Interface operates up to 66 MHz, and offers Native Hot Plug support designers extensive flexibility by supporting three addressing modes: transparent, opaque, and non-transparent. PCI 32/64-bit addressing and 32-bit data Operates up to 66 MHz Clocking/ EEPROM PCIe Interface (x1) Reset Controller Up to eight outstanding memory reads PCI clock outputs for up to four devices Four external PCI masters supported through internal arbiter 3.3V PCI I/Os, 5V tolerant MSI generation and handling using interrupt and GPIO signals Posted UpstreamUpstream Posted Writer Queue Interrupt Buffer Power Other Features Handling Mgmt Mux Logic Non- Non- Masquerade mode Posted Posted Buffer Queue JTAG IEEE 1149.1, 1149.6 Error Cong Posted Handling Posted Registers Four GPIO pins and four interrupt pins that can generate MSIs Writer Queue Buffer Mux Logic D0, D3 hot, D3 cold power management state support Non- Non- 1.2V core power supply, 3.3V I/O GPIO JTAG Posted Posted DownstreamDownstream No power sequencing constraints Buffer Queue Packaging: BGA: 144-pin, 10 x 10 mm, 0.8 mm ball pitch, Industrial oper- ating temperature, with RoHS/Green and Eutectic packages LQFP: 176-pin, 20 x 20 mm, Commercial operating tempera- PCI PCI Clock PCI Interface ture, RoHS compliant Arbiter Outputs 80E2010 BK001 01 (Tsi382) Figure 1 Block Diagram 1 of 2 August 14, 2009 2008 Integrated Device Technology, Inc.Tsi382 Evaluation Board Product Brief Smallest Footprint The Tsi382 BGA package has the smallest footprint of any PCIe-to- Camera Camera Camera Camera PCI device on the market. The device is offered in a 10x10 mm package with a standard 0.8 mm ball pitch, making it ideal for PCI Video Video Video Video ExpressCard applications or similar designs that have limited compo- Decoder Decoder Decoder Decoder nent space. For cost-sensitive applications, the Tsi382 is also available PCI Bus in a LQFP package. In addition, by providing sufficient clock outputs for up to four PCI devices, board space is further reduced by eliminating the need for an external clock buffer. Tsi382 80E2010 TA002 02 Low Power Consumption The Tsi382 has typical power consumption of less than 0.7W, and it x1 PCIe incorporates advanced power management modes to minimize Figure 2 DVR Application consumption during operation. High Performance In addition to low-latency operation, the Tsi382s superior queueing architecture and rich feature set allow designers to optimize their overall system performance. Features such as short-term caching also enable x1 PCIe PCI Tsi382 I/O Controller designers to tune the devices performance for different applications. Transparent, Non-transparent, and Opaque Bridging 80E2010 TA001 01 Transparent mode operation is available for efficient, flow through configurations. Non-transparent bridging also enables multi-host Figure 3 ExpressCard Application systems and is used in applications such as intelligent adapter cards. Opaque mode provides semi-transparent operation for multi-processor configurations and enhanced private device support. Typical Applications The Tsi382 is suited to applications that need to bridge PCIe to downstream PCI devices. Its flexibility, high performance, small foot- print, and low power consumption, make it ideal for a wide range of applications, including: Digital video recorders ExpressCards for laptop computers Motherboards (PC, ultra-mobile PC, server, SBC, industrial PC) PC adapter cards (communications, graphics, imaging, and multimedia) Multifunction printers Line cards and NICs August 16, 2004August 16, 200 NOT AN OFFER FOR SALE The information presented herein is subject to a Non-Disclosure Agreement and is for planning purposes only. Nothing contained in this presenta- tion, whether verbal or written, is intended as, or shall have the effect of, a sale or an offer for sale that creates a contractual power of acceptance. CORPORATE HEADQUARTERS for SALES: for Tech Support: 6024 Silver Creek Valley Road 800-345-7015 or 408-284-8200 email: ssdhelp idt.com San Jose, CA 95138 fax: 408-284-2775 phone: 408-284-8208 www.idt.com document: 80E2010 FB001 05 2 of 2 August 14, 2009