XF Plastic Package Family of Low Phase XF Noise Quartz-based PLL Oscillators Datasheet Description Features Output types: LVDS, LVPECL, CML The XF devices are ultra-low phase noise quartz-based PLL oscillators supporting a large range of frequencies and output Frequency range: 15MHz to 2100MHz interface types. These devices are designed to operate at three Output type: HCSL different power supplies with several pinout configurations, as well Frequency range: 15MHz to 725MHz as two operational temperature ranges. Supply voltage options: 1.8V, 2.5V, or 3.3V The XF devices can be programmed to generate an output Phase jitter (12kHz to 20MHz): 120fs typical frequency from 15MHz to 2100MHz with a resolution as low as Package options: 1Hz accuracy. The configuration capability of this family of devices allows for fast delivery times for both sample and large production 5.0 3.2 mm orders. 3.2 2.5 mm 2.5 2.0 mm Parts are for one time programming (OTP) at the factory for a fixed frequency application, or can be field programmable using Operating temperatures and frequency stability: I2C, based on system needs (see notes under Pin Descriptions). -40C to +85C, 25ppm -40C to +105C, 50ppm Typical Applications FOM Gear Box Data centers 10G / 40G / 100G / 400G Ethernet Pin Assignments Figure 1. 2.5 2.0 mm Package Figure 2. 5.0 3.2 mm and 3.2 2.5 mm Packages SDA 7 NC 1 12 Ground Core 11 NC 2 V Core DD OE 1 6 VDD 3 10 Ground Output Voltage Control 4 9 Output 0b SDA NC 2 5 OUT0b 5 8 Output 0 OE SCL 6 7 V Output DD GND34 OUT0 8 SCL 2022 Renesas Electronics Corporation 1 R31DS0029EU0601 February 10, 2022XF Datasheet Pin Descriptions Table 1. Pin Descriptions for 2.5 2.0 mm Package Pin Number Pin Name Description 1 NC No connect. 2 NC No connect. 2 3 Voltage Control Voltage control for VCXO option. 1 4 SDA Serial data. 5 OE Output enable. 1 6 SCL Serial clock. 7 V Output Supply voltage. DD 8 Output 0 Output 0. 9 Output 0b Complementary output 0. 10 Ground Output Connect to ground. 11 V Core Supply voltage. DD 12 Ground Core Connect to ground. 13 EPAD (dotted area shown in Pin Assignments diagram) Connect to ground (required for heat dissipation). 1 Pins 4 and 6 are no connect for non-I2C applications. 2 Pin 3 is no connect for non-analog VCXO applications. See Ordering Information (VCXO) for more details. Table 2. Pin Descriptions for 5.0 3.2 mm and 3.2 2.5 mm Packages Pin Pin Name Description 1 OE Output Enable (0 = output disabled, pulled high internally) 2 NC No connect 3 GND Connect to ground 4 OUT0 Output 5 OUT0b Complementary output 6 V Supply voltage DD 1 7 SDA Serial data 1 8 SCL Serial clock 1 Pins 7 and 8 are no connect for non-I2C applications. See Ordering Information (VCXO) for more details. 2022 Renesas Electronics Corporation 2 R31DS0029EU0601 February 10, 2022