Automotive Sensor Signal Conditioner ZSSC3170 with LIN and PWM Interface Datasheet Brief Description Benefits The ZSSC3170 is a CMOS integrated circuit for highly Measurement and temperature signal available via accurate amplification and sensor specific correction one output pin of bridge sensor signals. Featuring a maximum analog Compatible with nearly all resistive bridge inputs gain of 420, as well as extended offset compensation No external trimming components required capabilities, the ZSSC3170 is adjustable to nearly all Single-pass calibration minimizes calibration costs resistive bridge sensor types. End-of-line calibration using sensor output Digital compensation of offset, sensitivity, temperature Optimized for automotive environments with drift, and nonlinearity is accomplished via a 16-bit special protection circuitry, excellent electro- RISC microcontroller. Conditioning coefficients are magnetic compatibility, and numerous diagnostic stored in an EEPROM certified for automotive appli- features AEC-Q100-qualified cations. Measured values are provided by one of the digital Available Support LIN or PWM interfaces. Each interface can support Evaluation Kit end-of-line calibration using the sensor output. Noise sensitivity is greatly reduced because the calibration Application Notes equipment and the ZSSC3170 are mated digitally. Calculation Tools For quick and easy evaluation and support for calibrating prototypes, IDT offers the ZSSC3170 SSC Physical Characteristics Evaluation Kit, which includes evaluation hardware, Supply voltage: 7 to 18 V SSOP20 samples, and software. Current consumption in Sleep Mode: 100A Input span: 1.8 to 267 mV/V Features ADC resolution: 13 to 14 bit Complies with LIN specifications 1.3 / 2.0 / 2.1 Output resolution: up to 12-bit (LIN and PWM) Configurable LIN publisher frame content Operating temperature range: -40 to 125C Data conversion rate of up to 430Hz fully utilizes Extended operating temperature range: 150C the maximum LIN channel capacity of 20kbit/s RoHS-compliant delivery form options: PWM high-side and low-side switches, support for SSOP20, DFN20, or die LIN communication for end-of-line calibration Digital compensation of offset, gain, temperature ZSSC3170 Basic Circuit nd rd effects up to 2 order, and nonlinearity up to 3 order. Compensation of temperature sensor offset, LIN nd gain, and nonlinearity up to 2 order. GND Internal or external temperature reference VBAT Media temperature sensing by diode or RTD Load dump protection of the LIN pin up to 40V Accuracy 0.25% FSO -20 to 85C 0.50% FSO -40 to 125C 1.00% FSO -40 to 150C 3 EEPROM words available for optional user data 2016 Integrated Device Technology, Inc. 1 May 30, 2016 May 27, 2016 ZSSC3170Automotive Sensor Signal Conditioner ZSSC3170 with LIN and PWM Interface Datasheet VDDA 2 SCL TM Ext. Temp. I C * Control Registers SDA Diode ZSSC3170 VBR T Sensor HOUT Bridge Temp. Sens. Gain Offset ADC Block Diagram RAM PWM Select Factor Shift Mode LOUT VTN1 VBN MUX PGA ADC CMC LIN LIN VBP Analog Front-End (AFE) EEPROM Protection & VB VTN2 Power Internal Management Temp. VSSE Sensor VBR B Digital Block Interfaces VSSA ZSSC3170 2 * I C is a trademark of NXP. Applications LIN Pressure Sensor with Temperature Sensor LIN C3 11 LIN VSS 10 220pF Sensor Bridge 12 LOUT VSSE 9 GND With Integrated Temperature Diode 13 n.c. 8 VB VBAT C2 R1 14 7 220nF 10W VBN HOUT 15 6 VBR B VDD 16 VBP SCL 5 SCL RTD Media Temperature 17 VTN 1 SDA 4 SDA Sensor 18 VBR T VSSA 3 R2 19 VTN2 VDDA 2 C1 100nF 20 n.c. n.c. 1 Ordering Information (See section 7 in the data sheet for additional options.) Product Sales Code Description Package ZSSC3170FE1B ZSSC3170 Die Revision F Temperature range: -40C to +150C Unsawn on Wafer, 2450 pcs. ZSSC3170FE1C ZSSC3170 Die Revision F Temperature range: -40C to +150C Sawn on Wafer Frame, 2450 pcs. ZSSC3170FE2 ZSSC3170 SSOP20 Revision F Temperature range: -40C to +150C Add R for 13 reel, 2000 pcs. Add T for tube, 660 pcs. ZSSC3170EE1B ZSSC3170 Die Revision E Temperature range: -40C to +150C Unsawn on Wafer, 2450 pcs. ZSSC3170EE1C ZSSC3170 Die Revision E Temperature range: -40C to +150C Sawn on Wafer Frame, 2450 pcs. ZSSC3170EE2 ZSSC3170 SSOP20 Revision E Temperature range: -40C to +150C Add R for 13 reel, 2000 pcs. Add T for tube, 660 pcs. ZSSC3170EE3R ZSSC3170 DFN20 Revision E Temperature Range -40C to +150C 13 Reel, 4500 pcs ZSSC3170EA1B ZSSC3170 Die Revision E Temperature range: -40C to +125C Unsawn on Wafer, 2450 pcs. ZSSC3170EA1C ZSSC3170 Die Revision E Temperature range: -40C to +125C Sawn on Wafer Frame, 2450 pcs. ZSSC3170EA3R ZSSC3170 DFN20 Revision E Temperature Range -40C to +125C 13 Reel, 4500 pcs ZSSC3170KIT ZSSC3170 Evaluation Kit and 5 SSOP20 samples Kit . 2016 Integrated Device Technology, Inc. 2 May 30, 2016 May 27, 2016 ZSSC3170 Ext. RTD